AMAOE EMMC-3 0.15mm Multi-IC BGA Reballing Stencil for eMMC, UFS & NAND

Name: AMAOE EMMC-3 0.15mm Multi-IC BGA Reballing Stencil for eMMC, UFS & NAND
Brand: AMAOE
SKU: EMMC-3
Availability: InStock

₹199.00

Brand: AMAOE

Model: EMMC-3

Availability: In Stock

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Tags: EMMC-3 UFS NAND

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Product Description

The AMAOE EMMC-3 0.15mm Multi-IC BGA Reballing Stencil is designed for reballing a wide range of memory IC packages used in mobile and electronic repair. It supports eMMC, eMCP, UFS, uMCP, LPDDR, NAND and PCIe memory IC applications with multiple BGA layouts.

Brand	AMAOE
Model	EMMC-3
Application	eMMC / eMCP / UFS / uMCP / LPDDR / NAND / PCIe Memory IC Reballing
Supported BGA	BGA60, BGA70, BGA110, BGA153, BGA162, BGA169, BGA178, BGA186, BGA200, BGA221, BGA254, BGA297 & BGA315
Thickness	0.15mm
Type	Multi-IC BGA Reballing Stencil
Package	1 × Stencil

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