AMAOE EU-3 0.12mm Exynos IC BGA Reballing Stencil for Samsung

AMAOE EU-3 0.12mm Exynos IC BGA Reballing Stencil for Samsung

β‚Ή179.00
Brand:
Model: EU-3
Availability: In Stock
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Product Description

The AMAOE EU-3 0.12mm CPU BGA Reballing Stencil is designed for Samsung Exynos processor and RAM reballing during mobile motherboard repair. It supports multiple Exynos IC layouts, making it suitable for technicians working on compatible Samsung devices.

Key Features

  • Brand: AMAOE
  • Model: EU-3
  • Thickness: 0.12mm
  • Material: Japanese steel sheet
  • Type: CPU and RAM BGA reballing stencil
  • Supported ICs: Exynos 7885 CPU/RAM, Exynos 9820, Exynos 9610 CPU/RAM, Exynos 990 CPU/RAM and Exynos 980
  • Application: IC reballing and Samsung motherboard repair

The stencil helps align solder balls or solder paste with the matching BGA pad pattern during IC rework.

Compatibility Note: Verify the IC model and stencil layout before use to ensure the correct pattern is selected.

🚚 Shipping & Delivery Information

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