AMAOE G977-010 0.10mm Middle Layer BGA Reballing Stencil for Samsung Galaxy S10 5G

Name: AMAOE G977-010 0.10mm Middle Layer BGA Reballing Stencil for Samsung Galaxy S10 5G
Brand: AMAOE
SKU: G977U
Availability: InStock

₹199.00

Brand: AMAOE

Model: G977U

Availability: In Stock

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Tags: G977 Stencil Middle Layer BGA Reballing

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Product Description

AMAOE G977-010 is a 0.10mm middle-layer BGA reballing stencil designed for the Samsung Galaxy S10 5G G977 series motherboard. It is used to recreate the solder points on the intermediate layer of the layered motherboard during board separation, repair and reassembly.

Model: G977-010
Thickness: 0.10mm
Compatible Device: Samsung Galaxy S10 5G
Compatible Board Series: G977
Compatible Variants: G977U / G977R / G977T / G977P
Product Type: Middle Layer BGA Reballing Stencil
Application: Motherboard middle-layer solder point rework and reassembly
Size: 70 × 70mm
Package: 1 × Stencil

This stencil is for the middle-layer motherboard soldering process and is not a CPU or individual IC reballing stencil.

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