AMAOE MI17 0.12mm CPU BGA Reballing Stencil for Redmi Note 12 Pro/12 Pro+ Dimensity 810/1100/1200

Name: AMAOE MI17 0.12mm CPU BGA Reballing Stencil for Redmi Note 12 Pro/12 Pro+ Dimensity 810/1100/1200
Brand: AMAOE
SKU: MI-17
Availability: InStock

₹179.00

Brand: AMAOE

Model: MI-17

Availability: In Stock

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Tags: MI17 Stencil CPU Reballing BGA Stencil

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Product Description

AMAOE MI17 is a 0.12mm CPU BGA reballing stencil designed for mobile motherboard repair. It is intended for reballing compatible MediaTek Dimensity processors used in selected Redmi smartphones.

The stencil is listed for Redmi Note 12 Pro and Redmi Note 12 Pro+ models with supported Dimensity 810, Dimensity 1100 and Dimensity 1200 CPU patterns. Before use, check the processor model and stencil pattern to ensure compatibility.

Brand	AMAOE
Model	MI17
Thickness	0.12mm
Type	CPU BGA Reballing Stencil
Supported Processors	MediaTek Dimensity 810 / 1100 / 1200
Compatible Devices	Redmi Note 12 Pro / Redmi Note 12 Pro+
Application	CPU Reballing and Mobile Motherboard Repair
Package	1 × Stencil

The 0.12mm stencil provides the required solder-ball layout for compatible CPU reballing work. It is intended for professional BGA rework and microsoldering applications.

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