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AMAOE MI7 0.12mm CPU BGA Reballing Stencil for Snapdragon 625/425 Xiaomi Redmi & Mi Series
βΉ179.00
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Product Description
AMAOE MI7 is a 0.12mm CPU BGA reballing stencil designed for Qualcomm MSM8953 and MSM8917 processors. MSM8953 corresponds to Snapdragon 625, while MSM8917 corresponds to Snapdragon 425. The stencil is suitable for CPU reballing and motherboard repair on compatible Xiaomi and Redmi devices.
Specifications:
- Model: MI7
- Thickness: 0.12mm
- Compatible CPU: Qualcomm MSM8953 / MSM8917
- Chipsets: Snapdragon 625 / Snapdragon 425
- Compatible Devices: Redmi Note 4X, Redmi 4, Redmi 4A, Redmi 5A, Redmi 5 Plus, Redmi S2, Xiaomi Mi 5X and Mi Max 2
- Application: CPU BGA Reballing and Motherboard Repair
- Package: 1 Γ Stencil
For best compatibility, match the processor code on the motherboard with MSM8953 or MSM8917 before using the stencil.
π Shipping & Delivery Information
UToolsZone Fast & Reliable DeliveryWhen you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

π¦ Estimated Delivery Time
Total delivery time = Processing Time + Shipping Timeπ¦ Processing Time
Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.βοΈ Shipping Time
Shipping time refers to the duration your package takes to travel from our warehouse to your address.π Important Note
Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.Thank you for shopping with UToolsZone β€οΈ
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