AMAOE MT6799W CPU BGA Reballing Stencil for MediaTek Helio X30 and Compatible ICs

Name: AMAOE MT6799W CPU BGA Reballing Stencil for MediaTek Helio X30 and Compatible ICs
Brand: AMAOE
SKU: MT6799W
Availability: InStock

₹179.00

Brand: AMAOE

Model: MT6799W

Availability: In Stock

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Description
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Product Description

The AMAOE MT6799W CPU BGA Reballing Stencil is designed for mobile phone motherboard repair and CPU chip reballing. It helps technicians align solder balls with the compatible BGA package layout during chip-level repair.

Key Features

Designed for CPU BGA reballing and motherboard repair.
Associated with MediaTek Helio X30 and the IC models listed below.
Helps maintain accurate solder-ball placement during reballing.
Suitable for mobile repair technicians and electronics workshops.

Compatible IC Models

MT6799W
MBG967W
MT6179W
MT6335WP

Product Specifications

Brand: AMAOE
Model: MT6799W
Stencil Thickness: 0.12 mm
Product Type: CPU BGA Reballing Stencil
Application: Mobile motherboard repair and IC reballing

Usage Note: Confirm the chip marking and stencil aperture layout before use to ensure compatibility with the target IC.

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🚚 Shipping & Delivery Information

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When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

📦 Estimated Delivery Time

Total delivery time = Processing Time + Shipping Time

📦 Processing Time

Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.