AMAOE SAM11 0.12mm CPU BGA Reballing Stencil for Samsung Galaxy A40s, A8s and J7

Name: AMAOE SAM11 0.12mm CPU BGA Reballing Stencil for Samsung Galaxy A40s, A8s and J7
Brand: AMAOE
SKU: SAM-11
Availability: InStock

₹179.00

Brand: AMAOE

Model: SAM-11

Availability: In Stock

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Tags: Samsung A40s AMAOE SAM11 BGA

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Description
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Product Description

The AMAOE SAM11 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and mobile motherboard repair on compatible Samsung devices. It supports the listed Qualcomm Snapdragon 710 (SDM710) and Samsung Exynos 7904 processor platforms.

The multi-function BGA stencil helps technicians position solder paste or solder balls on the compatible CPU contact layout during chip rework. Its 0.12mm thickness is intended for the specified stencil pattern.

Product Specifications

Brand: AMAOE
Model: SAM-11
Thickness: 0.12mm
Type: Multi-function CPU BGA reballing stencil
Supported processor platforms: Qualcomm SDM710 and Samsung Exynos 7904
Application: CPU reballing and mobile motherboard repair

Listed Compatible Devices and Model References

Samsung Galaxy J7 — J720
Samsung Galaxy A30 — A305
Samsung Galaxy A8s — G8870 / G887
Samsung Galaxy A40s

Compatibility Note: Confirm the processor marking and BGA layout before use. Phone model codes and processor platforms can vary by region, so verify compatibility with the actual motherboard.

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🌍 Important Note

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