AMAOE SAM3 0.12mm Exynos 7420 CPU BGA Reballing Stencil for Samsung Galaxy S6 and Note5

Name: AMAOE SAM3 0.12mm Exynos 7420 CPU BGA Reballing Stencil for Samsung Galaxy S6 and Note5
Brand: AMAOE
SKU: SAM-3
Availability: InStock

₹199.00

Brand: AMAOE

Model: SAM-3

Availability: In Stock

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Tags: Samsung S6 AMAOE SAM3 BGA

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Product Description

The AMAOE SAM3 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Samsung Galaxy devices using the Exynos 7420 processor platform. Its multi-function stencil layout supports chip-level servicing where the matching BGA pattern is required.

Key Features

Brand: AMAOE
Model: SAM3
Thickness: 0.12mm
Material: Tin steel, as stated in the supplied product title
Type: Multi-function CPU BGA reballing stencil
Supported Processor: Samsung Exynos 7420
Listed Compatible Devices: Samsung Galaxy S6, S6 Plus and Galaxy Note5
Application: CPU reballing and mobile motherboard repair

The stencil helps technicians align solder balls or solder paste with the corresponding BGA contact layout during CPU rework.

Compatibility Note: Verify the processor marking and stencil pattern against the actual motherboard before use. Device variants may use different hardware configurations.

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