AMAOE SM8450 0.12mm Lower Layer BGA Reballing Stencil for Snapdragon 8 Gen 1
₹249.00
Model: SM-8450 8Gen1
Availability:
In Stock
Product Description
AMAOE SM8450 0.12mm Lower Layer BGA Reballing Stencil
The AMAOE SM8450 is a 0.12mm lower layer BGA reballing stencil designed for the Qualcomm Snapdragon 8 Gen 1 (SM8450) processor. It is used for lower-layer CPU reballing and chip-level motherboard repair work.
The stencil provides the required aperture pattern for the SM8450, helping with accurate solder ball placement during the BGA reballing process.
Product Details
| Brand | AMAOE |
| Model | SM8450 |
| Compatible CPU | Qualcomm Snapdragon 8 Gen 1 (SM8450) |
| Type | Lower Layer BGA Reballing Stencil |
| Thickness | 0.12mm |
| Package | 1 × Stencil |
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