AMAOE U-QSD12 Qualcomm Snapdragon CPU & IC BGA Reballing Stencil

Name: AMAOE U-QSD12 Qualcomm Snapdragon CPU & IC BGA Reballing Stencil
Brand: AMAOE
SKU: U-QSD12
Availability: InStock

₹199.00

Brand: AMAOE

Model: U-QSD12

Availability: In Stock

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Tags: CPU Reballing Qualcomm Repair BGA Stencil

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Product Description

AMAOE U-QSD12 Qualcomm Snapdragon CPU & IC BGA Reballing Stencil

The AMAOE U-QSD12 is a multi-pattern BGA reballing stencil for mobile motherboard repair. It is designed for selected Qualcomm Snapdragon CPUs and supporting ICs, helping technicians restore solder ball patterns during chip-level repairs.

Supported IC Models

CPU: SM7635, SM7550, SM6450, SM4450
Power ICs: PM4450, PM6450
Other IC: SDR435

Specifications: Model U-QSD12, 0.12 mm thickness.

Note: Confirm the IC marking and matching stencil pattern before reballing.

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When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

📦 Estimated Delivery Time

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Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.