AMAOE U-SMG3 Samsung Exynos CPU & RAM BGA Reballing Stencil

Name: AMAOE U-SMG3 Samsung Exynos CPU & RAM BGA Reballing Stencil
Brand: AMAOE
SKU: U-SMG3
Availability: InStock

₹199.00

Brand: AMAOE

Model: U-SMG3

Availability: In Stock

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Tags: Exynos Reballing RAM Repair BGA Stencil

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Product Description

AMAOE U-SMG3 Samsung Exynos CPU & RAM BGA Reballing Stencil

The AMAOE U-SMG3 is a multi-pattern BGA reballing stencil designed for Samsung Exynos motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs and RAM during chip-level mobile phone repairs.

Supported IC Models

CPU: Exynos 9810, Exynos 9820, Exynos 850, Exynos 3830
RAM: RAM556
Application: CPU and RAM reballing for compatible Samsung Exynos boards

Specifications: Model U-SMG3, 0.12 mm thickness, stainless steel stencil.

Note: Confirm the IC marking and stencil pattern before use. Individual PA and power IC patterns are not specified in the verified compatibility list.

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🚚 Shipping & Delivery Information

UToolsZone Fast & Reliable Delivery

When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

📦 Estimated Delivery Time

Total delivery time = Processing Time + Shipping Time

📦 Processing Time

Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.