AMAOE Universal BGA Reballing Stencil 0.3mm, 0.35mm, 0.4mm & 0.5mm

AMAOE Universal BGA Reballing Stencil 0.3mm, 0.35mm, 0.4mm & 0.5mm

β‚Ή199.00 β‚Ή249.00 -20%
Brand:
Model: HS-022
Availability: In Stock
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Product Description

AMAOE Universal BGA Reballing Stencil

The AMAOE Universal BGA Reballing Stencil is a multi-function stencil designed for mobile phone motherboard repair. It supports multiple solder ball pitches, making it useful for technicians working with compatible BGA chips during chip-level repairs.

Key Features.

  • Supports 0.3 mm, 0.35 mm, 0.4 mm and 0.5 mm solder ball pitches
  • Includes parallel-hole and 45-degree hole patterns
  • Suitable for compatible CPU, eMMC, UFS and power IC reballing
  • Square-hole design for solder ball placement
  • Reusable stainless steel construction

Specifications: Brand AMAOE, multi-function universal stencil, 0.12 mm thickness.

Note: Choose the correct hole pattern and solder ball size for the IC package before reballing.

🚚 Shipping & Delivery Information

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