AMAOE 0.12mm BGA Reballing Stencil for Dimensity 8100 Max MT6895Z Lower Layer

Name: AMAOE 0.12mm BGA Reballing Stencil for Dimensity 8100 Max MT6895Z Lower Layer
Brand: AMAOE
SKU: MT6895Z
Availability: InStock

₹249.00

Brand: AMAOE

Model: MT6895Z

Availability: In Stock

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Tags: Dimensity Stencil Reballing

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Description
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Product Description

AMAOE 0.12mm BGA Reballing Stencil for Dimensity 8100 Max MT6895Z Lower Layer

Model-specific lower-layer BGA reballing stencil for MediaTek Dimensity 8100 Max MT6895Z.

The AMAOE 0.12mm BGA Reballing Stencil is designed for MediaTek Dimensity 8100 Max (MT6895Z) lower-layer reballing applications. It is intended for IC and motherboard repair work where reballing of the corresponding BGA package is required.

Product Features

MT6895Z Compatible – Designed for the MediaTek Dimensity 8100 Max.
Lower Layer Stencil – Intended specifically for lower-layer BGA reballing work.
0.12mm Thickness – Product thickness specified for this stencil.
BGA Reballing – Suitable for professional IC and motherboard repair applications.

Compatibility

Compatible Chip:
MediaTek Dimensity 8100 Max (MT6895Z)

Application:
Lower Layer BGA Reballing

Specifications

Brand	AMAOE
Model	MT6895Z
Compatible Chip	Dimensity 8100 Max
Type	BGA Reballing Stencil
Application	Lower Layer
Thickness	0.12mm

Package Includes

1 × AMAOE MT6895Z BGA Reballing Stencil

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