AMAOE SM8350 0.12mm Wafer Positioning BGA Reballing Stencil for Snapdragon 888

Name: AMAOE SM8350 0.12mm Wafer Positioning BGA Reballing Stencil for Snapdragon 888
Brand: AMAOE
SKU: SM8350
Availability: InStock

₹249.00

Brand: AMAOE

Model: SM8350

Availability: In Stock

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Tags: SM8350 Snapdragon 888 Reballing

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AMAOE SM8350 0.12mm Wafer Positioning BGA Reballing Stencil

The AMAOE SM8350 is a 0.12mm wafer positioning BGA reballing stencil designed for Qualcomm Snapdragon 888 (SM8350) chip reballing work.

Its dedicated aperture layout helps position solder balls accurately during BGA reballing and chip-level motherboard repair.

Brand	AMAOE
Model	SM8350
Compatible IC	Qualcomm Snapdragon 888 (SM8350)
Thickness	0.12mm
Type	Wafer Positioning BGA Reballing Stencil
Package	1 × Stencil

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