The AMAOE SAM21 CPU BGA Reballing Stencil is designed for CPU reballing and chip-level motherboard repair on compatible Samsung Galaxy S25 series devices. It is listed for the Qualcomm Snapdragon 8 Elite (SM8750) processor platform. Key Features Brand: AMAOE Model: SAM21 Type: CPU BGA reballing stencil Supported Processor: Qualcomm Snapdragon 8 Elite (SM8750) Compatible Devices: Samsung Galaxy S25 and Galaxy S25+ Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching CPU BGA contact pattern during chip rework. Compatibility Note: Confirm the installed processor and BGA layout before use. Compatibility may vary by device variant and motherboard revision.

The AMAOE SAM22 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and chip-level motherboard repair on compatible Samsung Galaxy A17 devices. It is listed for selected processor layouts, including MT6789V, SM6475 and MT6769V. Key Features Brand: AMAOE Model: SAM22 Thickness: 0.12mm Type: CPU BGA reballing stencil Listed Processor Codes: MT6789V, SM6475 and MT6769V Compatible Device: Samsung Galaxy A17, subject to processor and board layout Application: CPU reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA contact pattern during chip rework. Compatibility Note: Processor codes can correspond to different device platforms. Confirm the actual chipset marking and stencil layout against the motherboard before use.

The AMAOE SAM3 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Samsung Galaxy devices using the Exynos 7420 processor platform. Its multi-function stencil layout supports chip-level servicing where the matching BGA pattern is required. Key Features Brand: AMAOE Model: SAM3 Thickness: 0.12mm Material: Tin steel, as stated in the supplied product title Type: Multi-function CPU BGA reballing stencil Supported Processor: Samsung Exynos 7420 Listed Compatible Devices: Samsung Galaxy S6, S6 Plus and Galaxy Note5 Application: CPU reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding BGA contact layout during CPU rework. Compatibility Note: Verify the processor marking and stencil pattern against the actual motherboard before use. Device variants may use different hardware configurations.

The AMAOE SAM4 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Samsung Galaxy devices using supported Exynos processor layouts. It is a multi-function stencil for chip-level repair work where the matching BGA pattern is required. Key Features Brand: AMAOE Model: SAM4 Thickness: 0.12mm Type: Multi-function CPU BGA reballing stencil Supported Processors: Exynos 3470, Exynos 7580 and Exynos 7880, as listed by the supplier Listed Compatible Models: Samsung Galaxy A7, A5, A3, S5 and J7 Application: CPU reballing and mobile motherboard repair The stencil helps technicians position solder balls or solder paste according to the matching BGA layout during CPU rework. Compatibility Note: Check the processor marking and BGA layout before use. Samsung devices may have different processor variants, so confirm that the stencil pattern matches the motherboard being repaired.

The AMAOE SAM9 0.12mm BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Samsung Galaxy J-series devices. It supports the processor families listed by the supplier for chip-level repair work. Key Features Brand: AMAOE Model: SAM9 Thickness: 0.12mm Type: CPU BGA reballing stencil Listed Processor Support: Exynos 7570, Exynos 3475, SC9830A and 7730S Listed Compatible Series: Samsung Galaxy J1, J2, J3 and J4 Application: CPU reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA layout during chip rework. Compatibility Note: Processor and motherboard configurations can vary by model and region. Verify the processor marking and BGA pattern before using the stencil.

The AMAOE Samsung Galaxy Note10 Middle Layer BGA Stencil is designed for motherboard repair and BGA rework on compatible Samsung Galaxy Note10 models. It is intended for use when the middle-layer BGA layout matches the stencil pattern. Key Features Brand: AMAOE Product Type: Middle Layer BGA Stencil Compatible Model Numbers: SM-N970U and N9700 Device Series: Samsung Galaxy Note10 Application: BGA rework and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding BGA pad layout during motherboard-level repair. Compatibility Note: Confirm the motherboard model and BGA pattern before use to ensure the stencil matches the device.

AMAOE Middle Layer BGA Reballing Stencil is designed for motherboard middle-layer repair and solder-pad rework on compatible Samsung Galaxy S20 series devices. Choose the Correct Stencil Stencil 1 SM-G986B / SM-G985F / SM-G986B Stencil 2 SM-G986B / SM-G985F / SM-G986N Important: Select the required stencil from the “Stencil Type” dropdown before adding the product to your cart. Only the selected stencil will be ordered unless the product option explicitly states otherwise. Match the codes with your motherboard before purchasing. Product Details Brand: AMAOE Product Type: Middle Layer BGA Reballing Stencil Application: Motherboard middle-layer repair and soldering rework Selection: Choose Stencil 1 or Stencil 2

AMAOE SLJ8E 0.20mm BGA Reballing Stencil The AMAOE SLJ8E is a 0.20mm BGA reballing stencil designed for compatible notebook chip reballing and chip-level motherboard repair work. Brand AMAOE Model SLJ8E Compatibility Notebook SLJ8E Thickness 0.20mm Type BGA Reballing Stencil Package 1 × Stencil

The AMAOE Middle Layer BGA Reballing Stencil is designed for motherboard middle-layer repair on compatible Samsung Galaxy S20 models. It helps technicians align solder paste or solder balls with the motherboard's middle-layer pad pattern during repair and reassembly. Product Specifications Brand: AMAOE Product Type: Middle Layer BGA Reballing Stencil Compatible Models: Samsung Galaxy S20 SM-G980F, SM-G981B / SM-G981N Application: Motherboard middle-layer soldering and rework Package Contents: 1 × Stencil Before Use: Check the model number printed on the device or motherboard and match the stencil pattern before beginning repair work.

AMAOE SM4450 4Gen2 0.12mm CPU BGA Reballing Stencil The AMAOE SM4450 4Gen2 is a dedicated 0.12mm CPU BGA reballing stencil for the Qualcomm Snapdragon 4 Gen 2 SM4450 processor. It is designed for CPU reballing and chip-level motherboard repair work. The stencil provides the required aperture pattern for the SM4450 CPU, helping with accurate solder ball placement during the BGA reballing process. Product Details Brand AMAOE Model SM4450 Compatible CPU Qualcomm Snapdragon 4 Gen 2 SM4450 Type CPU BGA Reballing Stencil Thickness 0.12mm Package

The AMAOE SM6225 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible smartphones using the matching Qualcomm Snapdragon 680 (SM6225) processor layout. Key Features Brand: AMAOE Model: SM6225 Thickness: 0.12mm Type: Universal-series CPU BGA reballing stencil Processor: Qualcomm Snapdragon 680 (SM6225), as specified in the product title Listed Compatible Models: OPPO A36, VIVO Y32, Huawei nova 9 SE and Redmi Note 11 International Version Application: CPU reballing and smartphone motherboard repair The stencil helps technicians position solder balls or solder paste according to the matching BGA layout during CPU rework. Compatibility Note: Confirm the processor and BGA pattern on the actual motherboard before use. Device variants may have different hardware configurations.

AMAOE SM6450 0.12mm CPU BGA Reballing Stencil The AMAOE SM6450 is a 0.12mm CPU BGA reballing stencil designed for the Qualcomm Snapdragon 6 Gen 1 platform. It is suitable for CPU reballing work on compatible devices such as the Honor X50. The stencil provides the required aperture pattern for SM6450 CPU reballing and solder ball placement during motherboard repair. Brand AMAOE Model SM6450 Compatible CPU Qualcomm Snapdragon 6 Gen 1 (SM6450) Compatible Device Honor X50 Thickness 0.12mm Type CPU BGA Reballing Stencil

AMAOE SM8350 0.12mm Wafer Positioning BGA Reballing Stencil The AMAOE SM8350 is a 0.12mm wafer positioning BGA reballing stencil designed for Qualcomm Snapdragon 888 (SM8350) chip reballing work. Its dedicated aperture layout helps position solder balls accurately during BGA reballing and chip-level motherboard repair. Brand AMAOE Model SM8350 Compatible IC Qualcomm Snapdragon 888 (SM8350) Thickness 0.12mm Type Wafer Positioning BGA Reballing Stencil Package 1 × Stencil

The AMAOE SM8450 0.12mm BGA Reballing Stencil is designed for CPU reballing and motherboard repair involving the Qualcomm Snapdragon 8 Gen 1 (SM8450) processor. It supports upper and lower layer BGA rework according to the matching stencil layout. Key Features Brand: AMAOE Model: SM8450 Thickness: 0.12mm Processor: Qualcomm Snapdragon 8 Gen 1 (SM8450) Type: CPU BGA reballing stencil Layer Support: Upper and lower layer Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding BGA pattern during CPU rework. Compatibility Note: Verify the processor marking and required upper or lower layer pattern before use to ensure the stencil matches the motherboard.

AMAOE SR1YJ 0.20mm BGA Reballing Stencil The AMAOE SR1YJ is a 0.20mm magnetic BGA reballing stencil designed for compatible notebook chip reballing and chip-level motherboard repair work. Brand AMAOE Model SR1YJ Compatibility Notebook SR1YJ Thickness 0.20mm Type BGA Reballing Stencil Feature Magnetic Package 1 × Stencil

AMAOE SR2EY 0.30mm BGA Reballing Stencil The AMAOE SR2EY is a 0.30mm BGA reballing stencil designed for compatible Intel 6th Gen notebook chip reballing and chip-level motherboard repair work. Brand AMAOE Model SR2EY Compatibility Intel 6th Gen (SR2EY) Notebook Thickness 0.30mm Type BGA Reballing Stencil

AMAOE SR2NH 0.15mm BGA Reballing Stencil The AMAOE SR2NH is a 0.15mm magnetic BGA reballing stencil designed for compatible notebook chip reballing and chip-level repair work. Brand AMAOE Model SR2NH Compatibility Notebook SR2NH Thickness 0.15mm Type BGA Reballing Stencil Feature Magnetic Package 1 × Stencil

AMAOE SR40B 0.20mm BGA Reballing Stencil The AMAOE SR40B is a 0.20mm BGA reballing stencil designed for the SR40B notebook chip. It is suitable for BGA reballing and chip-level motherboard repair work. Brand AMAOE Model SR40B Compatibility Notebook SR40B Thickness 0.20mm Type BGA Reballing Stencil Package 1 × Stencil

AMAOE SSD-1 BGA Reballing Stencil is designed for reballing and solder paste application on compatible SSD, NAND flash memory and U-Disk controller ICs. It helps technicians apply solder paste accurately to the chip's contact pads during chip-level repair and rework. Key Features Multi-size stencil for compatible BGA memory IC packages. Designed for SSD, NAND flash memory and U-Disk IC repair. Supports precise solder paste application during rework. Suitable for electronics motherboard and memory chip servicing. Supported BGA Sizes BGA100 BGA132 BGA136 BGA152 BGA272 BGA316 Applications SSD controller IC reballing NAND flash memory chip repair U-Disk memory IC rework Compatible BGA chip solder paste application Important: Confirm the chip's package layout and stencil markings before use. This stencil is intended for solder paste application; follow the manufacturer's recommended rework method.

AMAOE SU-1 0.12mm Spreadtrum CPU BGA Reballing Stencil The AMAOE SU-1 is a 0.12mm BGA reballing stencil designed for compatible Spreadtrum CPU chips. It supports a range of SC-series processors used for mobile motherboard repair and CPU reballing. The stencil provides the required aperture pattern for solder ball placement during BGA CPU reballing work. Brand AMAOE Model SU-1 Supported CPUs SC7727S / SC7730S / SC7730A / SC7731C / SC7731G / SC7715A / SC9832A / SC9830A / SC8830A / SC8825C / SC8825A / SC6825A Thickness 0.12mm Type Spreadtrum CPU BGA Reballing Stencil Package 1 × Stencil

AMAOE SU2 0.12mm Spreadtrum CPU BGA Reballing Stencil The AMAOE SU2 is a 0.12mm BGA reballing stencil designed for compatible Spreadtrum CPU chips. It is suitable for CPU reballing and chip-level motherboard repair. The stencil provides the required aperture patterns for solder ball placement on compatible SC-series CPUs during BGA reballing work. Brand AMAOE Model SU2 Supported CPUs SC6531E5 / SC9850 / SC6820 / SC9820A / SC6500D / SC6533G / SC6531DA / SC7731E Thickness 0.12mm Type Spreadtrum CPU BGA Reballing Stencil Package 1 × Stencil

AMAOE U-MTK1 MediaTek CPU & Power IC BGA Reballing Stencil The AMAOE U-MTK1 is a BGA reballing stencil for mobile phone motherboard repair. It is designed to help technicians align solder balls accurately when reworking compatible MediaTek (MTK) processors and supported IC layouts. Supported ICs MT6737 MT6735 MT6582 MT6750 MT6166V MT6325V MT6328V MT6323GA MT6176V MT6351V Product Features Designed for compatible MediaTek CPU and IC BGA reballing applications. Helps align solder balls during chip-level motherboard repair. Suitable for mobile phone repair technicians and electronics rework. Note: Confirm the exact IC marking and ball layout before use. Compatibility can vary by chip version.

AMAOE U-MTK2 MediaTek CPU & RAM BGA Reballing Stencil The AMAOE U-MTK2 is a multi-pattern BGA reballing stencil for mobile phone motherboard repair. It is designed for CPU and RAM reballing on compatible MediaTek chipsets and includes additional patterns for selected power, connectivity and other ICs. Supported CPU and RAM Patterns MT6595W CPU and RAM MT6795W CPU and RAM MT6797W CPU and RAM RAM256 pattern Additional Supported IC Markings MT6169V MT6331P 77643-11 77916-31 MT6630QP MT6632P DA9214 Product Features Multiple IC patterns for mobile motherboard BGA reballing. Helps align solder balls with the corresponding IC layout. Suitable for professional chip-level mobile phone repair. Compatibility Note: Match the IC marking and stencil pattern before use. RAM256 identifies a specific pattern and does not guarantee compatibility with every RAM chip. Confirm eMMC compatibility with the supplier before use, as it could not be independently verified for this model.

AMAOE U-MTK3 MediaTek CPU & Power IC BGA Reballing Stencil The AMAOE U-MTK3 is a multi-pattern BGA reballing stencil designed for mobile phone motherboard repair. It supports selected MediaTek (MTK) CPU and power management IC (PMIC) layouts, helping technicians perform solder-ball rework on compatible chips. Supported CPU ICs MT6763V MT6757V MT6739V MT6625LN MT6580A Supported Power Management ICs MT6350V MT6356W MT6357V MT6351DV Product Features Multiple BGA patterns for compatible MTK CPU and power IC reballing. Helps align solder balls with the corresponding IC layout. Suitable for mobile phone motherboard chip-level repair. Compatibility Note: Check the complete IC marking and matching stencil pattern before use. Compatibility may vary with the exact chip package.

AMAOE U-MTK4 MediaTek CPU & Power IC BGA Reballing Stencil The AMAOE U-MTK4 is a multi-pattern BGA reballing stencil for mobile phone motherboard repair. It is designed for selected MediaTek processors and supporting ICs, including power management and RF-related chips. It helps technicians align solder balls during compatible IC reballing work. Supported MediaTek CPU Models MT6768 MT6769V MT6762 MT6779V MT6771V Supported Power and Other ICs MT6186W MT6368W MT6358VW MT6357CRV Product Features Multiple BGA patterns for compatible MediaTek CPU and IC layouts. Designed for CPU and supporting IC reballing applications. Helps position solder balls accurately during motherboard repair. Reported stencil thickness: 0.12 mm. Compatibility Note: Confirm the complete IC marking and matching stencil pattern before use. Verify the supplied stencil's markings with the seller, as published compatibility lists can differ.

AMAOE U-MTK5 MediaTek Dimensity CPU & Power IC BGA Reballing Stencil The AMAOE U-MTK5 is a multi-pattern BGA reballing stencil for mobile phone motherboard repair. It is designed for selected MediaTek Dimensity processors and compatible power management and supporting ICs. The stencil helps technicians align solder balls during CPU and IC reballing. Supported MediaTek CPU Models MT6833V MT6853V MT6873 MT6875V MT6877V Supported Power and Supporting ICs MT6190W MT6360 BQ25980 MT6359VNP Product Features Multiple BGA patterns for supported MediaTek CPU and IC layouts. Designed for CPU and power IC reballing applications. Helps position solder balls accurately during motherboard repair. Reported stencil thickness: 0.12 mm. Compatibility Note: Check the complete IC marking and matching stencil pattern before use. Compatibility depends on the specific chip package and stencil layout.

AMAOE U-MTK6 MediaTek CPU & Multi-IC BGA Reballing Stencil The AMAOE U-MTK6 is a multi-pattern BGA reballing stencil designed for mobile phone motherboard repair. It supports selected MediaTek Dimensity CPU layouts, RAM patterns and additional power management and supporting ICs. It helps technicians align solder balls during compatible chip-level repair work. Supported MediaTek CPU Models MT6885Z MT6889Z MT6891Z MT6893Z MT6855V Supported Power and Other ICs MT6359VPP MT6360PP MT6363CW SC8571 VC7530 VC7916-55 MT6190W DA9313 MT6315GP 77048E 8258-21 58080-11 Product Features Multiple BGA patterns for supported MediaTek CPUs and associated ICs. Designed for CPU, RAM and compatible IC reballing applications. 0.12 mm stencil thickness as listed by specialist sellers. Suitable for mobile motherboard chip-level repair. Compatibility Note: Match the complete IC marking and stencil pattern before use. The U-MTK6 also has additional patterns, including RAM556 and BGA layouts; verify the supplied stencil's exact markings before relying on any specific compatibility.

AMAOE U-MTK7 BGA Reballing Stencil The AMAOE U-MTK7 is a multi-pattern BGA reballing stencil for mobile motherboard repair. It is designed for compatible MediaTek CPUs and supporting ICs. Supported IC Models CPU: MT6895Z, MT6983Z, MT6785V Other ICs: MT6637XP, MT6190MV, 58080-11, 77048E, MT6186MV, MT6319AP, 53730-11, SC8551A Additional listed patterns: RAM496, MT6359VKP, MT6375P, MT6360P, 77912-61 Note: Verify the exact IC marking and stencil pattern before use.

AMAOE U-MTK8 MediaTek Dimensity CPU BGA Reballing Stencil The AMAOE U-MTK8 is a precision BGA reballing stencil designed for compatible MediaTek Dimensity processors used in mobile phone motherboards. It helps technicians align solder balls during CPU reballing and chip-level repair. Supported IC Models MT6886V – Dimensity 7200 Ultra MT6878V – Dimensity 7300 series MT6835V – Dimensity 6100+ series MT6781V – MediaTek CPU MT6377W MT6197W Note: Confirm the complete IC marking and stencil pattern before use to ensure compatibility.

AMAOE U-QSD1 Qualcomm CPU & RAM BGA Reballing Stencil The AMAOE U-QSD1 is a Qualcomm BGA reballing stencil designed for mobile phone motherboard repair. It supports selected Snapdragon processor and RAM layouts, helping technicians perform accurate solder-ball rework during chip-level repairs. Supported IC Models MSM8976 / MSM8956 CPU and RAM MSM8992 CPU and RAM MSM8974 / MSM8274 / MSM8674 CPU Specifications: 0.12 mm thickness, according to specialist listings. Note: CPU and RAM may require different stencil patterns. Verify the exact IC layout before use.