AMAOE U-QSD3 Qualcomm Snapdragon CPU & IC BGA Reballing Stencil

Name: AMAOE U-QSD3 Qualcomm Snapdragon CPU & IC BGA Reballing Stencil
Brand: AMAOE
SKU: U-QSD3
Availability: InStock

₹199.00

Brand: AMAOE

Model: U-QSD3

Availability: In Stock

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Tags: CPU Reballing Qualcomm Repair BGA Stencil

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Product Description

AMAOE U-QSD3 Qualcomm Snapdragon CPU & IC BGA Reballing Stencil

The AMAOE U-QSD3 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It supports selected CPU and related IC layouts for chip-level mobile phone servicing.

Supported IC Models

CPU: MSM8916, MSM8939, MSM8909, MSM8952, SDM439
Other ICs: BGA221, RF5212A, PMI8952, PM8952, PM8909, PM8916, WCN3620, PMI632, RF7459A, WTR2965, WTR4905, WCN3610, WCN3615

Specifications: Model U-QSD3, 0.12 mm thickness, stainless steel stencil.

Note: Confirm the IC marking and matching stencil pattern before use.

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🚚 Shipping & Delivery Information

UToolsZone Fast & Reliable Delivery

When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

📦 Estimated Delivery Time

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📦 Processing Time

Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.