B&R F8 Soldering Tip Cleaner & Refresher is designed to clean oxidized soldering iron tips and help restore their ability to hold solder during electronics repair work. Key Features Helps remove oxidation from soldering iron tips. Helps restore solder wetting for smoother soldering. Suitable for soldering tip maintenance during mobile phone motherboard and electronics repair. Helps maintain tip performance during regular soldering work. How to Use Follow the instructions supplied with the product. After refreshing the heated tip, wipe off all remaining cleaner and apply fresh solder before using the tip on a circuit board. Note: Do not allow refresher residue to remain on the tip when soldering a PCB. Check the product packaging for specific usage and safety instructions.

B&R FX-9 Jumper Wire 0.01mm The B&R FX-9 ultra-fine jumper wire is designed for precision micro-soldering and mobile motherboard repair. It can be used for fine circuit connections and PCB track repairs where careful handling is required. Available Options Gold Insulated: Insulated wire for fine jumper connections. Silver Uninsulated: Uninsulated wire for repair applications that require exposed conductive wire. Applications Mobile phone motherboard and PCB repair Broken track and circuit connection repair Fine jumper wiring during micro-soldering Chip-level electronics repair Specifications Brand: B&R Model: FX-9 Listed Diameter: 0.01mm Wire Types: Gold Insulated and Silver Uninsulated Note: Select the required wire type before ordering. Handle carefully under magnification. Check the actual packaging to confirm the diameter and variant supplied.  

B&R X4301 43-in-1 BGA Maintenance Knife Set is designed for precision chip-level mobile phone repair. It helps technicians remove glue around CPU, NAND and BGA IC chips during disassembly, rework and motherboard servicing. The set includes a titanium alloy handle and 43 interchangeable blades in different shapes for detailed scraping and glue removal. It is suitable for technicians working on iPhone motherboards and other compatible mobile phone repair tasks. Key Features 43 interchangeable blades for different chip repair tasks. Titanium alloy handle for controlled manual handling. Designed for CPU, NAND and BGA IC glue removal. Suitable for motherboard maintenance and chip-level rework. Supplied in a storage case to keep the blades organized. Specifications Brand: B&R Model: X4301 Tool Type: BGA maintenance knife set Handle Material: Titanium alloy Set Contents: 1 handle and 43 blades Package: Storage case Size: 185 × 100 mm (listed package/set size) Applications iPhone CPU and NAND chip glue removal BGA IC disassembly and rework Mobile phone motherboard repair Precision adhesive scraping around chips Note: The blades are sharp precision tools. Work carefully under magnification to avoid damaging PCB tracks or nearby components.