MECHANIC QC-20 BGA IC Black Glue Remover Liquid for Motherboard Repair (20ml)

MECHANIC QC-20 is a specialized liquid solution designed to soften and remove hardened sealing glue and resin around BGA IC chips during mobile phone motherboard repair. It helps technicians loosen stubborn adhesive for chip-level repair and rework.

Key Features

• Liquid glue remover for BGA IC chip repair.
• Helps soften hardened black glue and resin adhesives.
• Suitable for mobile phone motherboard repair.
• Works on various cured resin adhesives, including epoxy and acrylic-based adhesives.
• 20ml bottle for professional repair use.

Specifications

• Brand: MECHANIC
• Model: QC-20
• Product Type: BGA IC Glue Removing Liquid
• Capacity: 20ml
• Application: Mobile motherboard and BGA IC glue removal

Safety Precautions

This solution is weakly acidic. Open the bottle carefully, avoid contact with eyes and skin, and use it in a well-ventilated area. Follow the product instructions and keep it away from children. For professional repair use only.