MECHANIC
100g MECHANIC UV 559 No-Clean Welding Flux BGA Solder Ball Repair Solder Auxiliary Soldering Paste
MECHANIC UV-559 100G FLUX PASTE MECHANIC UV-559 is a professional no-clean solder flux designed for BGA rework, PCB repair, mobile motherboard maintenance, and precision electronic soldering applications. β High Performance Soldering Flux Helps solder flow smoothly and evenly during repair work, reducing the possibility of poor solder joints and improving soldering efficiency. β No-Clean Formula Specially formulated to leave minimal residue after soldering, helping maintain a cleaner working area with low smoke generation and reduced odor. β Suitable for Precision Electronics Widely used for mobile phones, tablet motherboards, PCB repair, BGA rework, PGA components, and various SMD soldering applications. β High Insulation Performance Provides high surface insulation resistance after soldering, helping reduce electrical interference in electronic communication devices. β Advanced Flux Composition Made using a refined solder flux formula that offers stable storage performance, excellent soldering capability, and consistent application results. π Specifications Model: UV-559 Brand: MECHANIC Color: Milky White Type: No-Clean Flux Environmental Standard: Lead-Free Certification: RoHS Compliant Application: Industrial Use Only Weight: Approx. 100g π¦ Package Includes 1 Γ MECHANIC UV-559 No-Clean Lead-Free Solder Flux (100g)
MECHANIC QC-20 BGA IC Black Glue Remover Liquid for Motherboard Repair (20ml)
MECHANIC QC-20 is a specialized liquid solution designed to soften and remove hardened sealing glue and resin around BGA IC chips during mobile phone motherboard repair. It helps technicians loosen stubborn adhesive for chip-level repair and rework. Key Features Liquid glue remover for BGA IC chip repair. Helps soften hardened black glue and resin adhesives. Suitable for mobile phone motherboard repair. Works on various cured resin adhesives, including epoxy and acrylic-based adhesives. 20ml bottle for professional repair use. Specifications Brand: MECHANIC Model: QC-20 Product Type: BGA IC Glue Removing Liquid Capacity: 20ml Application: Mobile motherboard and BGA IC glue removal Safety Precautions This solution is weakly acidic. Open the bottle carefully, avoid contact with eyes and skin, and use it in a well-ventilated area. Follow the product instructions and keep it away from children. For professional repair use only.






