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AMAOE OV-2 0.12mm MSM8916 MSM8939 MSM8940 CPU BGA Reballing Stencil for OPPO and VIVO
βΉ179.00
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Product Description
The AMAOE OV-2 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible OPPO and VIVO smartphones using the supported Qualcomm processor layouts.
Key Features
- Brand: AMAOE
- Model: OV-2
- Thickness: 0.12mm
- Type: CPU BGA reballing stencil
- Supported Processors: Qualcomm MSM8916, MSM8939 and MSM8940
- Compatible Brands: OPPO and VIVO
- Application: CPU reballing and smartphone motherboard repair
The stencil helps technicians align solder balls or solder paste with the matching BGA layout during chip rework.
Compatibility Note: Verify the processor marking and stencil pattern before use to ensure compatibility with the motherboard being repaired.
π Shipping & Delivery Information
UToolsZone Fast & Reliable DeliveryWhen you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

π¦ Estimated Delivery Time
Total delivery time = Processing Time + Shipping Timeπ¦ Processing Time
Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.βοΈ Shipping Time
Shipping time refers to the duration your package takes to travel from our warehouse to your address.π Important Note
Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.Thank you for shopping with UToolsZone β€οΈ
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