AMAOE U-MTK6 MediaTek Dimensity CPU & Power IC BGA Reballing Stencil

AMAOE U-MTK6 MediaTek Dimensity CPU & Power IC BGA Reballing Stencil

β‚Ή179.00
Brand:
Model: U-MTK6
Availability: In Stock
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Product Description

AMAOE U-MTK6 MediaTek CPU & Multi-IC BGA Reballing Stencil

The AMAOE U-MTK6 is a multi-pattern BGA reballing stencil designed for mobile phone motherboard repair. It supports selected MediaTek Dimensity CPU layouts, RAM patterns and additional power management and supporting ICs. It helps technicians align solder balls during compatible chip-level repair work.

Supported MediaTek CPU Models

  • MT6885Z
  • MT6889Z
  • MT6891Z
  • MT6893Z
  • MT6855V

Supported Power and Other ICs

  • MT6359VPP
  • MT6360PP
  • MT6363CW
  • SC8571
  • VC7530
  • VC7916-55
  • MT6190W
  • DA9313
  • MT6315GP
  • 77048E
  • 8258-21
  • 58080-11

Product Features

  • Multiple BGA patterns for supported MediaTek CPUs and associated ICs.
  • Designed for CPU, RAM and compatible IC reballing applications.
  • 0.12 mm stencil thickness as listed by specialist sellers.
  • Suitable for mobile motherboard chip-level repair.

Compatibility Note: Match the complete IC marking and stencil pattern before use. The U-MTK6 also has additional patterns, including RAM556 and BGA layouts; verify the supplied stencil's exact markings before relying on any specific compatibility.

🚚 Shipping & Delivery Information

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