AMAOE U-QSD11 Qualcomm Snapdragon CPU BGA Reballing Stencil

Name: AMAOE U-QSD11 Qualcomm Snapdragon CPU BGA Reballing Stencil
Brand: AMAOE
SKU: U-QSD11
Availability: InStock

₹199.00

Brand: AMAOE

Model: U-QSD11

Availability: In Stock

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Tags: CPU Reballing Snapdragon Repair BGA Stencil

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Product Description

AMAOE U-QSD11 Qualcomm Snapdragon CPU BGA Reballing Stencil

The AMAOE U-QSD11 is a BGA reballing stencil designed for chip-level mobile motherboard repair. It supports selected Qualcomm Snapdragon processors, helping technicians restore solder ball patterns during CPU reballing.

Supported IC Models

Snapdragon 8 Gen 2: SM8550
Snapdragon 8s Gen 3: SM8635
Snapdragon 8 Gen 3: SM8650

Specifications: Model U-QSD11, 0.12 mm thickness, stainless steel stencil.

Note: Check the IC marking and stencil pattern before use to confirm compatibility.

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When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

📦 Estimated Delivery Time

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Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.