AMAOE U-QSD8 Qualcomm Snapdragon CPU BGA Reballing Stencil

Name: AMAOE U-QSD8 Qualcomm Snapdragon CPU BGA Reballing Stencil
Brand: AMAOE
SKU: U-QSD8
Availability: InStock

₹199.00

Brand: AMAOE

Model: U-QSD8

Availability: In Stock

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Tags: CPU Reballing Snapdragon Repair BGA Stencil

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Product Description

AMAOE U-QSD8 Qualcomm Snapdragon CPU BGA Reballing Stencil

The AMAOE U-QSD8 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs and supporting ICs during chip-level repairs.

Supported IC Models

CPU: SM7450, SM6225, SM7350, SM7315, SM7325
Other ICs: WCD9370, WCN3950, VC7643, VC7916-65, QPM5577, QFM2340, WCD9380, 77048E, 77040, 77042, ZK8903-00, SDR868, WCN6740, 58091-21, BGA254

Specifications: Model U-QSD8, 0.12 mm thickness, stainless steel stencil.

Note: Confirm the exact IC marking and stencil pattern before use.

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🚚 Shipping & Delivery Information

UToolsZone Fast & Reliable Delivery

When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

📦 Estimated Delivery Time

Total delivery time = Processing Time + Shipping Time

📦 Processing Time

Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.