AMAOE U-QSD2 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil The AMAOE U-QSD2 is a multi-pattern BGA reballing stencil for mobile motherboard repair. It is designed for selected Qualcomm Snapdragon CPUs, RAM chips and BGA153 ICs, helping technicians restore solder ball patterns during chip-level repairs. Supported IC Models CPU: MSM8998 (Snapdragon 835), MSM8996 (Snapdragon 820/821) RAM: MSM8998 RAM, MSM8996 RAM Other pattern: BGA153 Specifications: Model U-QSD2, 0.12 mm thickness, reusable steel stencil. Note: Check the IC marking and matching stencil pattern before use.

AMAOE U-QSD3 Qualcomm Snapdragon CPU & IC BGA Reballing Stencil The AMAOE U-QSD3 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It supports selected CPU and related IC layouts for chip-level mobile phone servicing. Supported IC Models CPU: MSM8916, MSM8939, MSM8909, MSM8952, SDM439 Other ICs: BGA221, RF5212A, PMI8952, PM8952, PM8909, PM8916, WCN3620, PMI632, RF7459A, WTR2965, WTR4905, WCN3610, WCN3615 Specifications: Model U-QSD3, 0.12 mm thickness, stainless steel stencil. Note: Confirm the IC marking and matching stencil pattern before use.

AMAOE U-QSD4 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil The AMAOE U-QSD4 is a multi-pattern BGA reballing stencil for mobile motherboard repair. It is designed for selected Qualcomm Snapdragon CPUs and supporting ICs, helping technicians restore solder ball patterns during chip-level repairs. Supported IC Models CPU: MSM8953, MSM8937, MSM8940, MSM8917, SDM632, SDM450 Power ICs: PM8937, PM8940, PMI8940, PMI8942, PM8953, PMI632 Other ICs: WTR2965, WCN3615, RF5428, RF5212A, 56020, BGA153, BGA178, BGA221 Specifications: Model U-QSD4, 0.12 mm thickness. Note: Verify the IC marking and stencil pattern before use.

AMAOE U-QSD5 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil The AMAOE U-QSD5 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon CPU and RAM chip repair. It helps mobile repair technicians restore solder ball patterns during motherboard-level servicing. Supported IC Models CPU: SM6125, SM6150, SDM636, SDM660, SDM670, SDM710 Other ICs: WCN3980, WCN3990, WCD9370, DA9313, PM670A, PM670, SDR660, PM6150, PM6150L, PMI632, BGA254, 56020, 7210M-11, PM1632, 77920-21 Specifications: Model U-QSD5, 0.12 mm thickness, stainless steel stencil with square-pattern openings. Note: Confirm the IC marking and stencil pattern before use.

AMAOE U-QSD6 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil The AMAOE U-QSD6 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It supports selected CPU, RAM and related IC layouts for chip-level mobile phone servicing. Supported IC Models CPU: SM8150, SM7150, SDM845 RAM: RAM556 Power ICs: PM8150, PM8150A, PM8150B, PM7150, PM7150A, PM845, PMI8998 Other ICs: DA9313, SMB1390, WCN3990, WCD9340, SDR8150, SDR660, QM57016, BGA153, BGA254 Specifications: Model U-QSD6, 0.12 mm thickness. Note: Confirm the IC marking and matching stencil pattern before use.

AMAOE U-QSD7 Qualcomm Snapdragon CPU & IC BGA Reballing Stencil The AMAOE U-QSD7 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It supports selected CPU, power management and related IC layouts for chip-level mobile phone servicing. Supported IC Models CPU: SM7250, SM7125, SM7225, SM6115, SM6350, SM6375, SM4375, SM4250 Related ICs: PM7250B, PM6250, PM4250, PM6375, PM6350, SDR735, SDR675, WTR3925, VC7643, QPM5541, QDM3301 Additional patterns: VC7916, 78190, 78191, 53735, QPM5677, 77645, 9902, 77612, 77912, 77040, 58255, QPM5577, QPM5579, BGA254 Specifications: Model U-QSD7, 0.12 mm thickness, stainless steel stencil. Note: Confirm the exact IC marking and stencil pattern before use.

AMAOE U-QSD8 Qualcomm Snapdragon CPU BGA Reballing Stencil The AMAOE U-QSD8 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs and supporting ICs during chip-level repairs. Supported IC Models CPU: SM7450, SM6225, SM7350, SM7315, SM7325 Other ICs: WCD9370, WCN3950, VC7643, VC7916-65, QPM5577, QFM2340, WCD9380, 77048E, 77040, 77042, ZK8903-00, SDR868, WCN6740, 58091-21, BGA254 Specifications: Model U-QSD8, 0.12 mm thickness, stainless steel stencil. Note: Confirm the exact IC marking and stencil pattern before use.

AMAOE U-QSD9 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil The AMAOE U-QSD9 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It supports CPU, RAM and related IC layouts used in chip-level mobile phone servicing. Supported IC Models CPU: SM8250 (Snapdragon 865), SM8250-002 (Snapdragon 870) RAM: RAM496, RAM556 Power ICs: PM8150A, PM8150B, PM8250 Other ICs: QCA6391, QPM5679, SDX865, SDX55M, DA9313, PMX55, PMW5100, WCD9385, 78190-31, 77040, BGA153 Specifications: Model U-QSD9, 0.12 mm thickness. Note: Check the IC marking and matching stencil pattern before use.

AMAOE U-SMG1 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG1 is a multi-pattern BGA reballing stencil designed for Samsung Exynos chip repair. It helps technicians restore solder ball patterns on compatible CPUs, RAM and related ICs during mobile motherboard repairs. Supported IC Models CPU: Exynos 8895, Exynos 7570, Exynos 7580, Exynos 3475 Related ICs: MAX778655, QM78038, SHANNON955, BGA221, BGA153, 4015B1, AFEM-9060, VJ51D, 77759-51, 605HP5, CS47L93 RAM: Exynos 8895 RAM Specifications: Model U-SMG1, 0.12 mm thickness. Note: Confirm the chip marking and matching stencil pattern before use.

AMAOE U-SMG2 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG2 is a multi-pattern BGA reballing stencil designed for Samsung Exynos chip repair. It helps technicians restore solder ball patterns on compatible CPUs, RAM and supporting ICs during mobile motherboard repairs. Supported IC Models CPU: Exynos 9610, 9611, 7904, 7885, 7884, 7880, 7870 RAM: Exynos 9610/9611 RAM, Exynos 7884/7885/7904 RAM, Exynos 7870/7880 RAM Power ICs: S2MU004X, S2MU005X03, SM5713, S915, S515, S527S Other ICs: BCM43456HKUBG, SHANNON937, D5328/TFBMA, 77656-11, MU106X01-5, BGA153 Specifications: Model U-SMG2, 0.12 mm thickness, stainless steel stencil. Note: Check the IC marking and matching stencil pattern before use.

AMAOE U-SMG3 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG3 is a multi-pattern BGA reballing stencil designed for Samsung Exynos motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs and RAM during chip-level mobile phone repairs. Supported IC Models CPU: Exynos 9810, Exynos 9820, Exynos 850, Exynos 3830 RAM: RAM556 Application: CPU and RAM reballing for compatible Samsung Exynos boards Specifications: Model U-SMG3, 0.12 mm thickness, stainless steel stencil. Note: Confirm the IC marking and stencil pattern before use. Individual PA and power IC patterns are not specified in the verified compatibility list.

AMAOE U-SMG4 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG4 is a multi-pattern BGA reballing stencil designed for Samsung Exynos motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs, RAM and supporting ICs during chip-level repairs. Supported IC Models CPU: Exynos 880, Exynos 980, Exynos 1080, Exynos 1280, E8825 RAM: RAM556, E8825 RAM Related ICs: SPU13P, SPU14P, 77098B, 77040, 77032, QPA5580, QPA4580, QFM3576, SM5714, SHANNON5511, SHANNON5510, S6565, 78201, 8267-11, 58083-11, S2MU106X01, S3700, BGA153, BGA254 Specifications: Model U-SMG4, 0.12 mm thickness, reusable stainless steel stencil. Note: Verify the IC marking and matching stencil pattern before use.

AMAOE U-SMG5 Samsung Exynos CPU & Power IC BGA Reballing Stencil The AMAOE U-SMG5 is a multi-pattern BGA reballing stencil designed for Samsung Exynos motherboard repair. It supports selected Exynos processors and related power, RAM and RF IC layouts for chip-level servicing. Supported IC Models CPU: Exynos 990, Exynos 2100, Exynos 2200, E9925 Power ICs: MAX77705C/F, SMR526, S5200A, S5311, SPS25, SPS26, SM3080 RAM and related ICs: RAM496, BGA153, W9020 Other ICs: SHANNON-A5123, SHANNON5510, QPM5825, 78217, 78105, 77098, 58083-11, TN2145, KM049, A9140 Specifications: Model U-SMG5, 0.12 mm thickness, stainless steel stencil. Note: Verify the chip marking and matching stencil pattern before use.

AMAOE U-Tensor Google Tensor CPU Lower Layer BGA Reballing Stencil The AMAOE U-Tensor is a 0.12 mm lower-layer BGA reballing stencil designed for Google Tensor CPU chip repair. It helps mobile repair technicians restore solder ball patterns during motherboard-level servicing. Specifications Brand: AMAOE Model: U-Tensor Application: Google Tensor CPU lower-layer reballing Thickness: 0.12 mm Note: Confirm the CPU package and stencil alignment before reballing.

AMAOE UN-1 UNISOC CPU & IC BGA Reballing Stencil The AMAOE UN-1 is a multi-pattern BGA reballing stencil designed for UNISOC mobile motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs and supporting ICs during chip-level servicing. Supported IC Models CPU: UMS512T, R818 Related ICs: UMW2652, UMW2651, RPM6743-31, SR3595D, 2233, UWP51065 BGA patterns: BGA221, BGA154, BGA254 Specifications: Model UN-1, 0.12 mm thickness, reusable stainless steel stencil with square-pattern openings. Note: Confirm the IC marking and matching stencil layout before use.

AMAOE UN-2 UNISOC CPU & IC BGA Reballing Stencil The AMAOE UN-2 is a multi-pattern BGA reballing stencil designed for UNISOC motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs and supporting ICs during chip-level mobile phone repairs. Supported IC Models CPU: UMW2652, UMP510G, UIS8910, UIP8910, UMS9230H Related ICs: SGM41512, RR88916, RR88643-21, RPM6743-31, SR3595D BGA patterns: BGA153, BGA200 Specifications: Model UN-2, 0.12 mm thickness, reusable steel stencil with square-pattern openings. Note: Confirm the IC marking and matching stencil pattern before use.

AMAOE Universal BGA Reballing Stencil The AMAOE Universal BGA Reballing Stencil is a multi-function stencil designed for mobile phone motherboard repair. It supports multiple solder ball pitches, making it useful for technicians working with compatible BGA chips during chip-level repairs. Key Features. Supports 0.3 mm, 0.35 mm, 0.4 mm and 0.5 mm solder ball pitches Includes parallel-hole and 45-degree hole patterns Suitable for compatible CPU, eMMC, UFS and power IC reballing Square-hole design for solder ball placement Reusable stainless steel construction Specifications: Brand AMAOE, multi-function universal stencil, 0.12 mm thickness. Note: Choose the correct hole pattern and solder ball size for the IC package before reballing.

Description BQ25892 IC   Brand New Compatible IC 100% Tested Specially manufactured for Mobile Phones, Precision machining fits the cell phone perfectly. Manufactured using high quality and excellent durable materials. The image shown is for presentation purposes only, the actual product may be different from what is shown in the image

. Original Power Management IC MAX77833 Power IC is designed for Samsung Galaxy S6 motherboard repair and power management circuit replacement. . Advanced PMIC Solution Supports power regulation, charging management, voltage control, and stable device operation during repair and maintenance procedures. . Fix Common Power Issues Ideal for repairing charging faults, power failures, boot issues, battery-related problems, and motherboard power circuit damage. . Precision Repair Component Manufactured for accurate compatibility with Samsung Galaxy S6 boards, helping technicians perform reliable micro-soldering repairs. . Professional Repair Use Suitable for mobile repair technicians, motherboard specialists, and advanced electronic repair environments. . Quality Checked Component Each IC is carefully inspected before dispatch to help ensure dependable repair performance and installation reliability. . Trusted by Technicians Available at UToolsZone, trusted by mobile repair professionals for premium IC chips, repair tools, and motherboard repair solutions.

■ Original MT6166V RF IC MT6166V Original IC specially designed for mobile motherboard repair, RF signal processing, communication control, and advanced chip-level servicing applications. ■ Professional Network Repair Solution Ideal for repairing mobile network faults, weak signal issues, communication failures, RF circuit problems, and motherboard-level hardware damage. ■ Advanced RF Transceiver Technology Supports RF signal transmission and reception functions required for stable network communication and reliable mobile device performance. ■ High Precision Motherboard Repair Component Designed for accurate chip replacement and professional micro-soldering repair procedures performed by experienced technicians. ■ Stable & Reliable Performance Manufactured using premium-grade materials to deliver consistent functionality, durability, and dependable repair results. ■ Suitable for Professional Technicians Perfect for mobile repair experts, motherboard specialists, chip-level repair engineers, and advanced repair laboratories. ■ Quality Checked Product Each IC is carefully inspected and quality checked before dispatch to help ensure reliable installation and repair performance. ■ Trusted by Repair Professionals Available at UToolsZone, trusted by mobile repair technicians for premium IC chips, motherboard repair components, and professional repair solutions.

■ Original MT6358W Power IC MT6358W Original Power IC specially designed for Samsung A315, Samsung A325, Redmi 9, and Redmi Note 9 motherboard repair and power management circuit replacement. ■ Advanced PMIC Power Management Solution Designed to manage power distribution, voltage regulation, battery control, and charging operations for stable device performance. ■ Fix Common Power & Charging Issues Ideal for repairing charging faults, dead phone problems, auto restart issues, boot failures, battery detection faults, and motherboard power circuit damage. ■ Professional Motherboard Repair Component Suitable for advanced chip-level repair, micro-soldering work, PMIC replacement, and motherboard servicing performed by professional technicians. ■ High Precision & Reliable Performance Manufactured using premium-grade materials to provide stable functionality, accurate compatibility, and long-lasting repair performance. ■ Quality Checked IC Chip Each IC is tested and carefully inspected before dispatch to help ensure dependable installation and repair reliability. ■ Trusted by Repair Professionals Available at UToolsZone, trusted by mobile repair technicians for premium IC chips, motherboard repair components, and professional repair solutions.

■ Original MT6360PP Power IC MT6360PP Power IC specially designed for Xiaomi Mi 8, Xiaomi Mi 6, and Redmi Note 8 motherboard repair, power management circuit replacement, and advanced chip-level servicing. ■ Advanced PMIC Power Management Solution Designed to manage voltage regulation, charging control, battery management, and stable power distribution required for reliable smartphone operation. ■ Fix Common Power & Charging Problems Ideal for repairing charging faults, dead phone issues, boot failures, auto restart problems, battery detection errors, and motherboard power circuit damage. ■ Professional Motherboard Repair Component Suitable for advanced micro-soldering work, PMIC replacement, motherboard troubleshooting, and chip-level repair performed by professional technicians. ■ High Precision & Reliable Performance Manufactured using premium-grade materials to provide stable functionality, accurate compatibility, and dependable repair performance. ■ Quality Checked IC Chip Each IC is carefully inspected and quality checked before dispatch to help ensure reliable installation and professional repair results. ■ Trusted by Repair Professionals Available at UToolsZone, trusted by mobile repair technicians for premium IC chips, motherboard repair components, and advanced repair solutions.

■ S2DPS01 Charger / Power IC S2DPS01 IC is a professional-grade charger and power management IC designed for Samsung S20 Ultra motherboard repair and charging circuit replacement. ■ Charging & Power Control Helps regulate charging function, power distribution, and stable voltage flow inside the device for smooth operation. ■ Fix Common Issues Ideal for repairing charging failure, dead phone condition, boot issues, restart problems, and motherboard power faults. ■ Precision Repair Component Designed for chip-level repair and accurate replacement on Samsung S20 Ultra boards, suitable for professional micro-soldering work. ■ Stable Performance Manufactured using high-quality materials to ensure reliable performance and long-lasting durability. ■ Quality Checked IC Each IC is tested and inspected before dispatch to ensure proper working condition. ■ Trusted by Technicians Available at UToolsZone, trusted by mobile repair professionals for IC chips, motherboard repair components, and advanced repair tools.

◆ S620 Power IC (Mobile Board Level Component) S620 power IC is used in mobile motherboard circuits for power regulation and stable voltage distribution in Samsung devices. ● Repair Usage This IC is commonly replaced when the phone has no power, sudden shutdown issues, or motherboard power failure problems. ● Function in Device It helps manage internal power flow between battery, CPU, and other board components for stable operation. ▶ Installation Use Used by professional mobile repair technicians during motherboard level IC replacement and repair work. ★ Important Note Proper testing and professional soldering equipment are required for installation on mobile PCBs.

◆ SDR660 003 Network IC (Board Level Component) This IC is used in smartphone motherboards to support network-related functions and signal processing in compatible Xiaomi and Oppo devices. ● Repair Usage Technicians usually consider this IC during network-related faults such as no signal, weak network, or unstable connectivity issues after board testing. ● Board Level Role It works as part of the communication section on the motherboard, helping maintain proper network operation between system components. ▶ Professional Use This component is used in IC-level repair work and should be handled with proper testing tools and soldering equipment. ★ Important Note Diagnosis is required before replacement, as similar symptoms can also be caused by antenna, baseband or other network section faults.

◆ SMB1351-004 Charging IC (Board Level Component) This IC is used in Xiaomi Mi 5 series smartphones for handling charging and power management functions on the motherboard. ● Repair Usage It is generally replaced when the device shows charging failure, no power, or unstable battery detection issues after board testing. ● Function Role The IC manages charging communication and power flow between battery and main board to ensure proper device operation. ▶ Technician Use Used in motherboard-level repair where diagnosis confirms charging IC or power section fault. ★ Important Note Proper testing and soldering equipment are required before replacement, as similar faults may also come from battery or charging port issues.

WCN3615 WiFi Network IC is a motherboard-level chip used in some Xiaomi, Huawei, and Samsung smartphones for WiFi and network connectivity functions. ● Repair Usage This IC is generally replaced when the device has WiFi not working, weak signal, or network connectivity issues after motherboard diagnosis. ● Device Role It helps in handling wireless communication between hardware components for stable WiFi performance. ● Technician Note Replacement should only be done after proper testing because similar issues can also be caused by antenna or software faults.