AMAOE MI10 0.12mm BGA Reballing Stencil for Redmi K20/K20 Pro Xiaomi Mi 9 SM7150 SM8150

Name: AMAOE MI10 0.12mm BGA Reballing Stencil for Redmi K20/K20 Pro Xiaomi Mi 9 SM7150 SM8150
Brand: AMAOE
SKU: MI-10
Availability: InStock

₹179.00

Brand: AMAOE

Model: MI-10

Availability: In Stock

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Tags: MI10 Stencil BGA Reballing CPU Stencil

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Product Description

AMAOE MI10 is a 0.12mm BGA reballing stencil designed for CPU, RAM and compatible BGA IC reballing on Xiaomi and Redmi smartphone motherboards. It is associated with the Qualcomm SM7150 and SM8150 platforms and is suitable for precision solder-ball placement during IC repair.

The stencil is suitable for applications involving Redmi K20, Redmi K20 Pro and Xiaomi Mi 9, with compatibility based on the corresponding SM7150/SM8150 chipset and IC pattern. It can also be used for compatible Qualcomm platform ICs such as PM7150 and PM8150 series components, depending on the stencil pattern.

Brand	AMAOE
Model	MI10 / MI-10
Stencil Thickness	0.12mm
Type	BGA Reballing Stencil
Platform	Qualcomm SM7150 / SM8150
Compatible Devices	Redmi K20, Redmi K20 Pro, Xiaomi Mi 9
Applications	CPU, RAM & BGA IC Reballing
Package	1 × AMAOE MI10 BGA Stencil

The 0.12mm stencil provides the required pad pattern for reballing work and is intended for professional mobile motherboard and micro-soldering applications.

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