AMAOE MQ-1 0.12mm CPU BGA Reballing Stencil for Qualcomm and MediaTek

Name: AMAOE MQ-1 0.12mm CPU BGA Reballing Stencil for Qualcomm and MediaTek
Brand: AMAOE
SKU: MQ-1
Availability: InStock

₹179.00

Brand: AMAOE

Model: MQ-1

Availability: In Stock

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Tags: CPU BGA Stencil AMAOE MQ1 CPU Reballing

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Description
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Product Description

The AMAOE MQ-1 CPU BGA Reballing Stencil is designed for reballing compatible Qualcomm and MediaTek (MTK) CPU chips during mobile motherboard repair. The 0.12mm stencil helps align the solder-ball pattern with the matching IC layout.

Supported IC Models

Qualcomm

SDM710
SDM845 A / SDM845 B
SDM660
SDM845 RAM layout

MediaTek (MTK)

MT6771V
MT6739V
MT6763V
MT6757V

Product Specifications

Brand: AMAOE
Model: MQ-1
Thickness: 0.12mm
Product Type: CPU BGA Reballing Stencil
Compatible Platforms: Qualcomm and MediaTek
Application: CPU and compatible RAM BGA reballing
Package Contents: 1 × MQ-1 stencil

Important: Confirm the exact IC marking and match its pad layout with the stencil before use. Compatibility depends on the chip layout, not just the phone model.

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🌍 Important Note

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