AMAOE MU1 0.12mm MTK CPU Universal BGA Reballing Stencil

AMAOE MU1 0.12mm MTK CPU Universal BGA Reballing Stencil

β‚Ή179.00
Brand:
Model: MU-1
Availability: In Stock
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Product Description

The AMAOE MU1 0.12mm MTK CPU Universal BGA Reballing Stencil is designed for MediaTek CPU reballing and mobile motherboard repair. It supports multiple MTK processor layouts used in compatible smartphones.

Key Features

  • Brand: AMAOE
  • Model: MU1
  • Thickness: 0.12mm
  • Type: Universal MTK CPU BGA reballing stencil
  • Compatible ICs: MT6795W, MT6797W, MT6595, MT6732 and MT6750
  • Material: Japanese steel sheet, as listed by sellers
  • Application: CPU reballing and smartphone motherboard repair

The stencil helps technicians align solder balls or solder paste with the matching BGA pad layout during CPU rework.

Compatibility Note: Confirm the processor marking and BGA pattern before use to ensure the stencil matches the IC being repaired.

🚚 Shipping & Delivery Information

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