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AMAOE MU1 0.12mm MTK CPU Universal BGA Reballing Stencil
βΉ179.00
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Product Description
The AMAOE MU1 0.12mm MTK CPU Universal BGA Reballing Stencil is designed for MediaTek CPU reballing and mobile motherboard repair. It supports multiple MTK processor layouts used in compatible smartphones.
Key Features
- Brand: AMAOE
- Model: MU1
- Thickness: 0.12mm
- Type: Universal MTK CPU BGA reballing stencil
- Compatible ICs: MT6795W, MT6797W, MT6595, MT6732 and MT6750
- Material: Japanese steel sheet, as listed by sellers
- Application: CPU reballing and smartphone motherboard repair
The stencil helps technicians align solder balls or solder paste with the matching BGA pad layout during CPU rework.
Compatibility Note: Confirm the processor marking and BGA pattern before use to ensure the stencil matches the IC being repaired.
π Shipping & Delivery Information
UToolsZone Fast & Reliable DeliveryWhen you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

π¦ Estimated Delivery Time
Total delivery time = Processing Time + Shipping Timeπ¦ Processing Time
Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.βοΈ Shipping Time
Shipping time refers to the duration your package takes to travel from our warehouse to your address.π Important Note
Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.Thank you for shopping with UToolsZone β€οΈ
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