AMAOE U-QSD7 Qualcomm Snapdragon CPU & IC BGA Reballing Stencil

AMAOE U-QSD7 Qualcomm Snapdragon CPU & IC BGA Reballing Stencil

β‚Ή199.00
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Model: U-QSD7
Availability: In Stock
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Product Description

AMAOE U-QSD7 Qualcomm Snapdragon CPU & IC BGA Reballing Stencil

The AMAOE U-QSD7 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It supports selected CPU, power management and related IC layouts for chip-level mobile phone servicing.

Supported IC Models

  • CPU: SM7250, SM7125, SM7225, SM6115, SM6350, SM6375, SM4375, SM4250
  • Related ICs: PM7250B, PM6250, PM4250, PM6375, PM6350, SDR735, SDR675, WTR3925, VC7643, QPM5541, QDM3301
  • Additional patterns: VC7916, 78190, 78191, 53735, QPM5677, 77645, 9902, 77612, 77912, 77040, 58255, QPM5577, QPM5579, BGA254

Specifications: Model U-QSD7, 0.12 mm thickness, stainless steel stencil.

Note: Confirm the exact IC marking and stencil pattern before use.

🚚 Shipping & Delivery Information

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When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.
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🌍 Important Note

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