AMAOE U-QSD12 Qualcomm Snapdragon CPU & IC BGA Reballing Stencil The AMAOE U-QSD12 is a multi-pattern BGA reballing stencil for mobile motherboard repair. It is designed for selected Qualcomm Snapdragon CPUs and supporting ICs, helping technicians restore solder ball patterns during chip-level repairs. Supported IC Models CPU: SM7635, SM7550, SM6450, SM4450 Power ICs: PM4450, PM6450 Other IC: SDR435 Specifications: Model U-QSD12, 0.12 mm thickness. Note: Confirm the IC marking and matching stencil pattern before reballing.

AMAOE U-QSD2 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil The AMAOE U-QSD2 is a multi-pattern BGA reballing stencil for mobile motherboard repair. It is designed for selected Qualcomm Snapdragon CPUs, RAM chips and BGA153 ICs, helping technicians restore solder ball patterns during chip-level repairs. Supported IC Models CPU: MSM8998 (Snapdragon 835), MSM8996 (Snapdragon 820/821) RAM: MSM8998 RAM, MSM8996 RAM Other pattern: BGA153 Specifications: Model U-QSD2, 0.12 mm thickness, reusable steel stencil. Note: Check the IC marking and matching stencil pattern before use.

AMAOE U-QSD3 Qualcomm Snapdragon CPU & IC BGA Reballing Stencil The AMAOE U-QSD3 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It supports selected CPU and related IC layouts for chip-level mobile phone servicing. Supported IC Models CPU: MSM8916, MSM8939, MSM8909, MSM8952, SDM439 Other ICs: BGA221, RF5212A, PMI8952, PM8952, PM8909, PM8916, WCN3620, PMI632, RF7459A, WTR2965, WTR4905, WCN3610, WCN3615 Specifications: Model U-QSD3, 0.12 mm thickness, stainless steel stencil. Note: Confirm the IC marking and matching stencil pattern before use.

AMAOE U-QSD4 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil The AMAOE U-QSD4 is a multi-pattern BGA reballing stencil for mobile motherboard repair. It is designed for selected Qualcomm Snapdragon CPUs and supporting ICs, helping technicians restore solder ball patterns during chip-level repairs. Supported IC Models CPU: MSM8953, MSM8937, MSM8940, MSM8917, SDM632, SDM450 Power ICs: PM8937, PM8940, PMI8940, PMI8942, PM8953, PMI632 Other ICs: WTR2965, WCN3615, RF5428, RF5212A, 56020, BGA153, BGA178, BGA221 Specifications: Model U-QSD4, 0.12 mm thickness. Note: Verify the IC marking and stencil pattern before use.

AMAOE U-QSD5 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil The AMAOE U-QSD5 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon CPU and RAM chip repair. It helps mobile repair technicians restore solder ball patterns during motherboard-level servicing. Supported IC Models CPU: SM6125, SM6150, SDM636, SDM660, SDM670, SDM710 Other ICs: WCN3980, WCN3990, WCD9370, DA9313, PM670A, PM670, SDR660, PM6150, PM6150L, PMI632, BGA254, 56020, 7210M-11, PM1632, 77920-21 Specifications: Model U-QSD5, 0.12 mm thickness, stainless steel stencil with square-pattern openings. Note: Confirm the IC marking and stencil pattern before use.

AMAOE U-QSD6 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil The AMAOE U-QSD6 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It supports selected CPU, RAM and related IC layouts for chip-level mobile phone servicing. Supported IC Models CPU: SM8150, SM7150, SDM845 RAM: RAM556 Power ICs: PM8150, PM8150A, PM8150B, PM7150, PM7150A, PM845, PMI8998 Other ICs: DA9313, SMB1390, WCN3990, WCD9340, SDR8150, SDR660, QM57016, BGA153, BGA254 Specifications: Model U-QSD6, 0.12 mm thickness. Note: Confirm the IC marking and matching stencil pattern before use.

AMAOE U-QSD7 Qualcomm Snapdragon CPU & IC BGA Reballing Stencil The AMAOE U-QSD7 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It supports selected CPU, power management and related IC layouts for chip-level mobile phone servicing. Supported IC Models CPU: SM7250, SM7125, SM7225, SM6115, SM6350, SM6375, SM4375, SM4250 Related ICs: PM7250B, PM6250, PM4250, PM6375, PM6350, SDR735, SDR675, WTR3925, VC7643, QPM5541, QDM3301 Additional patterns: VC7916, 78190, 78191, 53735, QPM5677, 77645, 9902, 77612, 77912, 77040, 58255, QPM5577, QPM5579, BGA254 Specifications: Model U-QSD7, 0.12 mm thickness, stainless steel stencil. Note: Confirm the exact IC marking and stencil pattern before use.

AMAOE U-QSD8 Qualcomm Snapdragon CPU BGA Reballing Stencil The AMAOE U-QSD8 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs and supporting ICs during chip-level repairs. Supported IC Models CPU: SM7450, SM6225, SM7350, SM7315, SM7325 Other ICs: WCD9370, WCN3950, VC7643, VC7916-65, QPM5577, QFM2340, WCD9380, 77048E, 77040, 77042, ZK8903-00, SDR868, WCN6740, 58091-21, BGA254 Specifications: Model U-QSD8, 0.12 mm thickness, stainless steel stencil. Note: Confirm the exact IC marking and stencil pattern before use.

AMAOE U-QSD9 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil The AMAOE U-QSD9 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It supports CPU, RAM and related IC layouts used in chip-level mobile phone servicing. Supported IC Models CPU: SM8250 (Snapdragon 865), SM8250-002 (Snapdragon 870) RAM: RAM496, RAM556 Power ICs: PM8150A, PM8150B, PM8250 Other ICs: QCA6391, QPM5679, SDX865, SDX55M, DA9313, PMX55, PMW5100, WCD9385, 78190-31, 77040, BGA153 Specifications: Model U-QSD9, 0.12 mm thickness. Note: Check the IC marking and matching stencil pattern before use.

AMAOE U-SMG1 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG1 is a multi-pattern BGA reballing stencil designed for Samsung Exynos chip repair. It helps technicians restore solder ball patterns on compatible CPUs, RAM and related ICs during mobile motherboard repairs. Supported IC Models CPU: Exynos 8895, Exynos 7570, Exynos 7580, Exynos 3475 Related ICs: MAX778655, QM78038, SHANNON955, BGA221, BGA153, 4015B1, AFEM-9060, VJ51D, 77759-51, 605HP5, CS47L93 RAM: Exynos 8895 RAM Specifications: Model U-SMG1, 0.12 mm thickness. Note: Confirm the chip marking and matching stencil pattern before use.

AMAOE U-SMG2 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG2 is a multi-pattern BGA reballing stencil designed for Samsung Exynos chip repair. It helps technicians restore solder ball patterns on compatible CPUs, RAM and supporting ICs during mobile motherboard repairs. Supported IC Models CPU: Exynos 9610, 9611, 7904, 7885, 7884, 7880, 7870 RAM: Exynos 9610/9611 RAM, Exynos 7884/7885/7904 RAM, Exynos 7870/7880 RAM Power ICs: S2MU004X, S2MU005X03, SM5713, S915, S515, S527S Other ICs: BCM43456HKUBG, SHANNON937, D5328/TFBMA, 77656-11, MU106X01-5, BGA153 Specifications: Model U-SMG2, 0.12 mm thickness, stainless steel stencil. Note: Check the IC marking and matching stencil pattern before use.

AMAOE U-SMG3 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG3 is a multi-pattern BGA reballing stencil designed for Samsung Exynos motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs and RAM during chip-level mobile phone repairs. Supported IC Models CPU: Exynos 9810, Exynos 9820, Exynos 850, Exynos 3830 RAM: RAM556 Application: CPU and RAM reballing for compatible Samsung Exynos boards Specifications: Model U-SMG3, 0.12 mm thickness, stainless steel stencil. Note: Confirm the IC marking and stencil pattern before use. Individual PA and power IC patterns are not specified in the verified compatibility list.

AMAOE U-SMG4 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG4 is a multi-pattern BGA reballing stencil designed for Samsung Exynos motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs, RAM and supporting ICs during chip-level repairs. Supported IC Models CPU: Exynos 880, Exynos 980, Exynos 1080, Exynos 1280, E8825 RAM: RAM556, E8825 RAM Related ICs: SPU13P, SPU14P, 77098B, 77040, 77032, QPA5580, QPA4580, QFM3576, SM5714, SHANNON5511, SHANNON5510, S6565, 78201, 8267-11, 58083-11, S2MU106X01, S3700, BGA153, BGA254 Specifications: Model U-SMG4, 0.12 mm thickness, reusable stainless steel stencil. Note: Verify the IC marking and matching stencil pattern before use.

AMAOE U-SMG5 Samsung Exynos CPU & Power IC BGA Reballing Stencil The AMAOE U-SMG5 is a multi-pattern BGA reballing stencil designed for Samsung Exynos motherboard repair. It supports selected Exynos processors and related power, RAM and RF IC layouts for chip-level servicing. Supported IC Models CPU: Exynos 990, Exynos 2100, Exynos 2200, E9925 Power ICs: MAX77705C/F, SMR526, S5200A, S5311, SPS25, SPS26, SM3080 RAM and related ICs: RAM496, BGA153, W9020 Other ICs: SHANNON-A5123, SHANNON5510, QPM5825, 78217, 78105, 77098, 58083-11, TN2145, KM049, A9140 Specifications: Model U-SMG5, 0.12 mm thickness, stainless steel stencil. Note: Verify the chip marking and matching stencil pattern before use.

AMAOE U-Tensor Google Tensor CPU Lower Layer BGA Reballing Stencil The AMAOE U-Tensor is a 0.12 mm lower-layer BGA reballing stencil designed for Google Tensor CPU chip repair. It helps mobile repair technicians restore solder ball patterns during motherboard-level servicing. Specifications Brand: AMAOE Model: U-Tensor Application: Google Tensor CPU lower-layer reballing Thickness: 0.12 mm Note: Confirm the CPU package and stencil alignment before reballing.

AMAOE UN-1 UNISOC CPU & IC BGA Reballing Stencil The AMAOE UN-1 is a multi-pattern BGA reballing stencil designed for UNISOC mobile motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs and supporting ICs during chip-level servicing. Supported IC Models CPU: UMS512T, R818 Related ICs: UMW2652, UMW2651, RPM6743-31, SR3595D, 2233, UWP51065 BGA patterns: BGA221, BGA154, BGA254 Specifications: Model UN-1, 0.12 mm thickness, reusable stainless steel stencil with square-pattern openings. Note: Confirm the IC marking and matching stencil layout before use.

AMAOE UN-2 UNISOC CPU & IC BGA Reballing Stencil The AMAOE UN-2 is a multi-pattern BGA reballing stencil designed for UNISOC motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs and supporting ICs during chip-level mobile phone repairs. Supported IC Models CPU: UMW2652, UMP510G, UIS8910, UIP8910, UMS9230H Related ICs: SGM41512, RR88916, RR88643-21, RPM6743-31, SR3595D BGA patterns: BGA153, BGA200 Specifications: Model UN-2, 0.12 mm thickness, reusable steel stencil with square-pattern openings. Note: Confirm the IC marking and matching stencil pattern before use.

AMAOE Universal BGA Reballing Stencil The AMAOE Universal BGA Reballing Stencil is a multi-function stencil designed for mobile phone motherboard repair. It supports multiple solder ball pitches, making it useful for technicians working with compatible BGA chips during chip-level repairs. Key Features. Supports 0.3 mm, 0.35 mm, 0.4 mm and 0.5 mm solder ball pitches Includes parallel-hole and 45-degree hole patterns Suitable for compatible CPU, eMMC, UFS and power IC reballing Square-hole design for solder ball placement Reusable stainless steel construction Specifications: Brand AMAOE, multi-function universal stencil, 0.12 mm thickness. Note: Choose the correct hole pattern and solder ball size for the IC package before reballing.