2UUL BH11 Universal Phone Board Mid Frame Reballing Magnetic Platform

2UUL BH11 Universal Phone Board Mid Frame Reballing Magnetic Platform

✅ Main Features

• Strong built-in magnetic adsorption automatically holds the motherboard and stencil firmly in position.
• Designed for middle-layer reballing, BGA rework, CPU, IC and chip tin planting applications.
• Two platform groove depths (1mm and 2mm) support different motherboard and chip thicknesses.
• High-temperature resistant construction allows direct hot air gun operation during repair.
• Ensures precise alignment between stencil and pad for more uniform solder balls.
• Helps prevent stencil bulging and improves stencil service life.
• Compatible with both iPhone and Android motherboard repair applications.

🔧 Suitable Applications

• Phone motherboard middle layer reballing
• CPU and IC chip tin planting
• BGA rework and soldering
• Micro-soldering repair work
• PCB positioning and fixing
• iPhone and Android board maintenance

📋 Specifications

• Brand: 2UUL
• Model: BH11
• Type: Universal Magnetic Reballing Platform
• Groove Depth: 1mm & 2mm
• Heat Resistance: Yes
• Compatibility: Universal

📦 Package Includes

• 1 × 2UUL BH11 Universal Magnetic Platform
• 2 × Tin Scrapers / Blades
• Video Download Link: https://vimeo.com/2uul/download/766033574/719b724080