Search

2UUL BH15 MagGrid Pad Chip Silicone Buffer Soldering Pad ✅ Key Features Made from heat-resistant silicone material for high-temperature soldering and repair applications. MagGrid structure provides stable support and cushioning for delicate chips and electronic components. Helps protect BGA chips, CPUs and ICs from scratches and mechanical damage during maintenance. Easy to clean and resistant to solder flux, oil and residue. Compact design makes it suitable for precision repair and micro-soldering work. 🔧 Suitable For BGA chip repair and reballing CPU and IC maintenance Chip soldering and replacement Hard disk PCB repair Micro-soldering operations Protection and support of sensitive components 📋 Specifications Brand: 2UUL Model: BH15 Type: Magnetic Silicone Buffer Pad Material: Heat-Resistant Silicone Application: BGA, Hard Disk, CPU & IC Repair 📦 Package Includes 1 × 2UUL BH15 MagGrid Pad Chip Silicone Buffer Soldering Pad  ..

2UUL BH17 CPU Reball Base Magnetic Dual Sided BGA Reballing Platform Set for iPhone / Android Key Specifications & Components Model: BH17 (Cpureball Base). Structure: CNC-machined aluminum alloy body with a dual-sided magnetic frame for maximum stability. Included Stencils: Typically comes with 75 precision CPU stencils covering a wide range of chipsets. Stencil Thickness: Includes options for 0.12mm (some kits specify T0.6 for Apple and T0.35 for Android) to handle various reballing requirements. Dimensions: Platform size is approximately 58 × 58 × 11 mm with a net weight of 238g.  Features and Benefits Magnetic Locking: Features a powerful dual-sided magnetic system that holds both the CPU and the stencil firmly in place, preventing shifting during heating. High Compatibility: Supports a broad spectrum of mobile processors, including Apple A-series (A10 to A19), Qualcomm Snapdragon (up to SM8750/Snapdragon 8 Ultra), MediaTek (MTK), and Samsung Exynos. Efficiency: The dual-sided design allows technicians to switch between different chip types quickly without losing alignment, increasing workflow throughput. Thermal Contact: Engineered for improved thermal contact and heat resistance, ensuring the platform does not warp or lose magnetic strength during hot-air reflow.  Usage Tips Preparation: Always place the platform on a flat, stable work surface. Alignment: Carefully align the CPU and the magnetic stencil before applying heat to ensure even solder ball distribution. Heat Management: Avoid excessive hot air pressure which can cause "stencil lift." Do not overheat the base excessively to preserve the life of the internal magnets. Maintenance: Clean stencils thoroughly after each use with a suitable solvent (like Relife RL-055 dispenser bottle) to maintain aperture accurac..

2UUL SC02 Pre-Cut Thermal Silicone Pads 12x12x1.5mm 100Pcs/Box   1: 2uul sc02 Pre-cut Thermal Pads Heat Conducting Silica Gel  2: Pre-Cut Thermal Silicone Pads. Place over the area you want to protect from hot air 3: Pre-cut pads for easy placement. 12X12X1.5mm   PACKING DETAILS:- * ONLY 1 BOTTLE  100pcs/BOX..

2uul Sc09 CPU Fever Patch 2UUL SC09 CPU Fever Patch for Cooling CPU After Repair 2uul SC09 17x15x1.5mm CPU Pre-Cut Heatsink Silicone Pad for SSD CPU IC Chips - 50Pcs Features: The heatsink silicone pad can quickly fill electronic components, tiny gaps that rapidly conduct and dissipate heat generated by high-power CPUs/GPUs High pressure and high temperature resistant safe and stable Strong heat conduction and heat dissipation Strong insulation and comprehensive protection Escort for electronic equipment, excellent heat dissipation, worry-free insulation, suitable for Apple, Android phones, high-power LED modules, Integrated chips, and other scenarios Package includes: 50 x Heatsink Silicone Pad..

2uul Sc10 Cpu Fever Paste for Cooling Cpu After Repair   1. Solve the problem of repeated game restarts caused by high CPU temperature. 2. Does not freeze at low temperatures and does not freeze in high-temperature environments 3. Good heat conduction, good heat dissipation, and fast cooling. 4. Multi-scenario applications can be used for CPU, GPU, microcontroller development boards, etc.  CPU High Temperature * Quickly Cooling * No solidification at low temperature * Multi-Scenario Application Package includes: * 1 x 2UUL SC10 CPU FEVER PASTE..

AMAOE 0.12mm BGA Reballing Stencil for A1707 Hard Disk Master IC The AMAOE A1707 is a 0.12mm BGA reballing stencil designed for A1707 Hard Disk Master IC repair work. It is available in two different stencil options: CPU and RAM. Choose the required Stencil Type — CPU or RAM — according to the IC you need to reball. Each option is a dedicated stencil pattern for its respective IC. Available Stencil Types ``` CPU: A1707 CPU BGA reballing stencil RAM: A1707 RAM BGA reballing stencil Product Details ``` Brand AMAOE Model A1707 Stencil Type CPU / RAM Thickness 0.12mm Application BGA Reballing & IC Repair Select the correct option before ordering: Choose CPU for the CPU stencil or RAM for the RAM stencil...

AMAOE 337S00175 0.12mm BGA Reballing Stencil for Notebook CPU & RAM The AMAOE 337S00175 is a 0.12mm BGA reballing stencil designed for notebook board repair. It is available in two dedicated stencil types: CPU and RAM. Select the required Stencil Type before placing your order. Choose CPU for the CPU stencil or RAM for the RAM stencil. Each option has its own dedicated BGA pattern for the respective IC. Available Options CPU: 337S00175 CPU BGA reballing stencil RAM: 337S00175 RAM BGA reballing stencil Product Details Brand AMAOE Model 337S00175 Stencil Type CPU / RAM Thickness 0.12mm Application BGA Reballing & Notebook Board Repair Select the correct Stencil Type before ordering: Choose CPU or RAM according to the IC you need to reball...

AMAOE 339S00883 0.15mm BGA Reballing Stencil The AMAOE 339S00883 is a 0.15mm BGA reballing stencil designed for the Apple M1 CPU. It is suitable for CPU reballing and chip-level motherboard repair work. Brand AMAOE Model M1 CPU Compatible CPU Apple M1 CPU 339S00883 Thickness 0.15mm Type M1 CPU BGA Reballing Stencil Package 1 × Stencil..

AMAOE A17 0.12mm Lower Layer CPU BGA Reballing Stencil The AMAOE A17 is a 0.12mm lower layer CPU BGA reballing stencil designed for the Apple A17 CPU used in the iPhone 15 Pro and iPhone 15 Pro Max. It is used for CPU reballing and chip-level motherboard repair work. The stencil provides the required aperture pattern for the A17 CPU lower layer, helping with accurate solder ball placement during the BGA reballing process. Product Details Brand AMAOE Model A17 Compatible Models iPhone 15 Pro / iPhone 15 Pro Max Chip Apple A17 CPU Type Lower Layer CPU BGA Reballing Stencil Thickness 0.12mm Package 1 × Stencil..

The AMAOE AU1 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Apple iPhone devices using A7, A8 and A9 processors. Its stencil pattern supports CPU and RAM reballing work for the corresponding chip layouts. Key Features Brand: AMAOE Model: AU1 Thickness: 0.12mm Type: CPU and RAM BGA reballing stencil Supported Processors: Apple A7, A8 and A9 Compatible Device Brand: Apple iPhone Material: Japanese steel sheet Application: CPU/RAM reballing and iPhone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA layout during chip rework. Compatibility Note: Confirm the processor generation and stencil pattern before use to ensure compatibility with the motherboard being repaired...

The AMAOE AU3 CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Apple iPhone devices using A10, A11 or A12 processors. The AU3 stencil is listed for these Apple CPU generations by AMAOE. Key Features Brand: AMAOE Model: AU3 Type: CPU BGA reballing stencil Supported CPU Generations: Apple A10, A11 and A12 Compatible Device Brand: Apple iPhone Application: CPU reballing and motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding BGA layout during CPU rework. Compatibility Note: Confirm the CPU generation and stencil pattern before use to ensure compatibility with the motherboard being repaired...

AMAOE E8535P 0.12mm CPU BGA Reballing Stencil The AMAOE E8535P is a 0.12mm CPU BGA reballing stencil designed for the Samsung Exynos 1350 processor. It is suitable for CPU reballing and chip-level motherboard repair. The stencil provides the required aperture pattern for E8535P CPU reballing and solder ball placement. Brand AMAOE Model E8535P Compatible CPU Samsung Exynos 1350 (E8535P) Thickness 0.12mm Type CPU BGA Reballing Stencil Package 1 × Stencil..

The AMAOE EU-2 0.12mm BGA Reballing Stencil is designed for Samsung Exynos CPU reballing applications. It supports multiple Exynos chipset models and is suitable for chip-level BGA reballing and repair work. Brand AMAOE Model EU-2 Compatibility Exynos 7880, 8895A, 8895B, 9810, 7580, 7570, 3470, 3475 & 9180 Thickness 0.12mm Material Japanese Steel Sheet Type Exynos CPU BGA Reballing Stencil..

AMAOE Exynos 1380-E8835P 0.12mm CPU BGA Reballing Stencil The AMAOE Exynos 1380-E8835P is a 0.12mm CPU BGA reballing stencil designed for the Samsung Exynos 1380 processor. It is used for CPU reballing and chip-level motherboard repair work. The stencil provides the required aperture pattern for the E8835P CPU, helping with accurate solder ball placement during the BGA reballing process. Product Details Brand AMAOE Model Exynos1380-E8835P Compatible CPU Samsung Exynos 1380 (E8835P) Type CPU BGA Reballing Stencil Thickness 0.12mm Package 1 × Stencil..

AMAOE MI10 is a 0.12mm BGA reballing stencil designed for CPU, RAM and compatible BGA IC reballing on Xiaomi and Redmi smartphone motherboards. It is associated with the Qualcomm SM7150 and SM8150 platforms and is suitable for precision solder-ball placement during IC repair. The stencil is suitable for applications involving Redmi K20, Redmi K20 Pro and Xiaomi Mi 9, with compatibility based on the corresponding SM7150/SM8150 chipset and IC pattern. It can also be used for compatible Qualcomm platform ICs such as PM7150 and PM8150 series components, depending on the stencil pattern. Brand AMAOE Model MI10 / MI-10 Stencil Thickness 0.12mm Type BGA Reballing Stencil Platform Qualcomm SM7150 / SM8150 Compatible Devices Redmi K20, Redmi K20 Pro, Xiaomi Mi 9 Applications CPU, RAM & BGA IC Reballing Package 1 × AMAOE MI10 BGA Stencil The 0.12mm stencil provides the required pad pattern for reballing work and is intended for professional mobile motherboard and micro-soldering applications...

AMAOE MI11 is a 0.12mm BGA reballing stencil designed for CPU, RAM and other BGA IC reballing work on Xiaomi and Redmi motherboards. It provides the required solder-ball pattern for precise IC reballing and motherboard repair. The MI11 stencil supports multiple IC patterns including SM6125, SDM710, MT6785V and other compatible components. It is associated with Xiaomi CC9, CC9e, Mi 8 SE, Mi A3 and Redmi Note 8 series devices. Compatibility should be matched according to the IC or processor code before use. Brand AMAOE Model MI11 / MI-11 Thickness 0.12mm Type BGA Reballing Stencil IC / CPU Support SM6125, SDM710, MT6785V and compatible IC patterns Compatible Devices Xiaomi CC9, CC9e, Mi 8 SE, Mi A3, Redmi Note 8 and compatible models Application CPU, RAM & BGA IC Reballing Package 1 × Stencil The 0.12mm stencil is intended for professional mobile motherboard repair, IC reballing and microsoldering applications...

AMAOE MI12 is a 0.12mm BGA reballing stencil designed for Snapdragon 865 (SM8250) CPU reballing and motherboard repair. It is suitable for compatible Xiaomi and Redmi devices, including Xiaomi Mi 10, Mi 10 Pro and Redmi K30 Pro. The stencil provides a precise solder-ball pattern for reballing compatible CPU chips during mobile motherboard repair. Its 0.12mm thickness is intended for professional BGA rework and microsoldering applications. Brand AMAOE Model MI12 Thickness 0.12mm Type CPU BGA Reballing Stencil CPU Qualcomm Snapdragon 865 (SM8250) Compatible Devices Xiaomi Mi 10, Xiaomi Mi 10 Pro, Redmi K30 Pro Application CPU BGA Reballing and Mobile Motherboard Repair Package 1 × Stencil..

AMAOE MI15 is a 0.12mm BGA reballing stencil designed for CPU reballing and mobile motherboard repair. It is intended for compatible Qualcomm processors used in selected Xiaomi and Redmi smartphones. This stencil is listed for Xiaomi 12, Xiaomi 12 Pro, Xiaomi 12X and Redmi K50 eSports Edition. It supports the specified Qualcomm SM8450 and SM8250 BGA patterns. Check the processor marking and stencil pattern before use to ensure compatibility. Brand AMAOE Model MI15 Thickness 0.12mm Type CPU BGA Reballing Stencil Supported Chipsets Qualcomm SM8450 / SM8250 Compatible Devices Xiaomi 12, Xiaomi 12 Pro, Xiaomi 12X, Redmi K50 eSports Edition Application CPU BGA Reballing and Mobile Motherboard Repair Package 1 × Stencil The stencil is intended for professional BGA rework, CPU reballing and microsoldering applications. It helps position solder balls in the required pattern during IC reballing...

AMAOE MI17 is a 0.12mm CPU BGA reballing stencil designed for mobile motherboard repair. It is intended for reballing compatible MediaTek Dimensity processors used in selected Redmi smartphones. The stencil is listed for Redmi Note 12 Pro and Redmi Note 12 Pro+ models with supported Dimensity 810, Dimensity 1100 and Dimensity 1200 CPU patterns. Before use, check the processor model and stencil pattern to ensure compatibility. Brand AMAOE Model MI17 Thickness 0.12mm Type CPU BGA Reballing Stencil Supported Processors MediaTek Dimensity 810 / 1100 / 1200 Compatible Devices Redmi Note 12 Pro / Redmi Note 12 Pro+ Application CPU Reballing and Mobile Motherboard Repair Package 1 × Stencil The 0.12mm stencil provides the required solder-ball layout for compatible CPU reballing work. It is intended for professional BGA rework and microsoldering applications...

AMAOE MI19 is a 0.12mm BGA reballing stencil designed for Qualcomm Snapdragon 8 Gen 2 / SM8550 CPU reballing. It is suitable for Xiaomi 13 Series motherboard repair and CPU BGA reballing applications. Model: MI19 Thickness: 0.12mm CPU: Snapdragon 8 Gen 2 / SM8550 Compatible Series: Xiaomi 13 Series Application: CPU BGA Reballing Package: 1 × Stencil..

AMAOE MI7 is a 0.12mm CPU BGA reballing stencil designed for Qualcomm MSM8953 and MSM8917 processors. MSM8953 corresponds to Snapdragon 625, while MSM8917 corresponds to Snapdragon 425. The stencil is suitable for CPU reballing and motherboard repair on compatible Xiaomi and Redmi devices. Specifications: Model: MI7 Thickness: 0.12mm Compatible CPU: Qualcomm MSM8953 / MSM8917 Chipsets: Snapdragon 625 / Snapdragon 425 Compatible Devices: Redmi Note 4X, Redmi 4, Redmi 4A, Redmi 5A, Redmi 5 Plus, Redmi S2, Xiaomi Mi 5X and Mi Max 2 Application: CPU BGA Reballing and Motherboard Repair Package: 1 × Stencil For best compatibility, match the processor code on the motherboard with MSM8953 or MSM8917 before using the stencil...

The AMAOE MQ-1 CPU BGA Reballing Stencil is designed for reballing compatible Qualcomm and MediaTek (MTK) CPU chips during mobile motherboard repair. The 0.12mm stencil helps align the solder-ball pattern with the matching IC layout. Supported IC Models Qualcomm SDM710 SDM845 A / SDM845 B SDM660 SDM845 RAM layout MediaTek (MTK) MT6771V MT6739V MT6763V MT6757V Product Specifications Brand: AMAOE Model: MQ-1 Thickness: 0.12mm Product Type: CPU BGA Reballing Stencil Compatible Platforms: Qualcomm and MediaTek Application: CPU and compatible RAM BGA reballing Package Contents: 1 × MQ-1 stencil Important: Confirm the exact IC marking and match its pad layout with the stencil before use. Compatibility depends on the chip layout, not just the phone model...

The AMAOE MQ-2 CPU BGA Reballing Stencil is designed for reballing compatible Qualcomm and MediaTek (MTK) processor ICs during mobile motherboard repair. It helps technicians align solder-ball placement with the matching BGA pad pattern. Supported IC Models MediaTek (MTK) MT6779V MT6768 MT6765 Qualcomm SDM439 MSM8909W Product Specifications Brand: AMAOE Model: MQ-2 Product Type: CPU BGA Reballing Stencil Compatible Platforms: Qualcomm and MediaTek Application: CPU BGA reballing and motherboard-level repair Package Contents: 1 × AMAOE MQ-2 stencil Important: Confirm the exact IC marking and match its BGA pad layout with the stencil before use. Compatibility depends on the chip package and stencil pattern...

The AMAOE MQ-3 CPU BGA Reballing Stencil is designed for reballing compatible processor ICs during mobile motherboard repair. It helps technicians align solder-ball placement with the corresponding BGA pad pattern. Supported IC Models Qualcomm Snapdragon 865 (SM8250) Qualcomm SM7250 Qualcomm SM7150 Qualcomm SM6150 MediaTek MT6885Z Product Specifications Brand: AMAOE Model: MQ-3 Product Type: CPU BGA Reballing Stencil Compatible Platforms: Qualcomm and MediaTek Application: CPU BGA reballing and motherboard repair Package Contents: 1 × AMAOE MQ-3 stencil Important: Check the exact IC marking and match the BGA pad layout with the stencil before use. Compatibility depends on the chip package and stencil pattern. This product listing is for the stencil only...

The AMAOE MQ-4 CPU BGA Reballing Stencil is designed for reballing compatible Qualcomm and MediaTek ICs during mobile motherboard repair. Its 0.12mm stencil plate helps align solder-ball placement with the corresponding BGA layout. Supported IC Models Qualcomm SM8350 — Snapdragon 888 SM8450 — Snapdragon 8 Gen 1 SM7315 — Snapdragon 778G SM7325 — Snapdragon 778G+ MediaTek (MTK) MT6833V — Dimensity 810 MT6799W MT6877V — Dimensity 900 Product Specifications Brand: AMAOE Model: MQ-4 Thickness: 0.12mm Product Type: CPU BGA Reballing Stencil Compatible Platforms: Qualcomm and MediaTek Application: CPU and supported RAM BGA reballing Package Contents: 1 × AMAOE MQ-4 stencil Important: Check the exact IC marking and match its BGA pad layout with the stencil before use. Some patterns may be intended for RAM rather than CPU chips. This listing includes one stencil...

The AMAOE MQ-5 CPU BGA Reballing Stencil is designed for professional mobile phone motherboard repair and CPU reballing work. It helps technicians position solder balls accurately when working with compatible BGA chip packages. Key Features Designed for CPU BGA reballing and chip-level motherboard repair. Supports selected Qualcomm and MediaTek processor packages. Helps maintain accurate solder-ball placement during reballing. Suitable for mobile phone repair technicians and electronics workshops. Compatible IC Models MediaTek: MT6859Z, MT6983Z, MT8176V Qualcomm: SM8475, SM6225, SM7450, SM8550 RAM marking listed by supplier: RAM496 Product Specifications Brand: AMAOE Model: MQ-5 Product Type: CPU BGA Reballing Stencil Application: Mobile motherboard and IC repair Note: Confirm the chip marking and stencil layout before use to ensure compatibility with the target processor...

The AMAOE MQ-6 CPU BGA Reballing Stencil is designed for mobile phone motherboard repair and CPU reballing applications. It helps technicians align solder balls with the BGA pad layout when servicing compatible processor packages. Key Features Designed for CPU BGA reballing and chip-level repair. Supports selected Qualcomm and MediaTek IC packages. Helps achieve consistent solder-ball placement during reballing. Suitable for mobile repair technicians and electronics workshops. Compatible IC Models Qualcomm: SM6450, SM8650, SM4450 MediaTek: MT6985W, MT6781V, MT6879, MT8781V Specifications Brand: AMAOE Model: MQ-6 Type: CPU BGA Reballing Stencil Application: Mobile motherboard and IC repair Note: Check the processor marking and stencil aperture layout before use to confirm compatibility...

The AMAOE MT6781V CPU BGA Reballing Stencil is intended for chip-level mobile phone motherboard repair involving compatible MediaTek processor packages. It helps technicians align solder balls with the CPU's BGA pad layout during reballing work. Key Features Designed for CPU BGA reballing applications. Made for compatible MediaTek MT6781V processor layouts. Helps with solder-ball alignment during chip rework. Suitable for mobile phone repair technicians and electronics workshops. Product Specifications Brand: AMAOE IC Model: MT6781V Product Type: CPU BGA Reballing Stencil Application: Mobile motherboard repair and CPU reballing Usage Note: Confirm the processor marking and stencil aperture pattern before use. Stencil thickness and package contents should be verified with the supplier...

The AMAOE MT6799W CPU BGA Reballing Stencil is designed for mobile phone motherboard repair and CPU chip reballing. It helps technicians align solder balls with the compatible BGA package layout during chip-level repair. Key Features Designed for CPU BGA reballing and motherboard repair. Associated with MediaTek Helio X30 and the IC models listed below. Helps maintain accurate solder-ball placement during reballing. Suitable for mobile repair technicians and electronics workshops. Compatible IC Models MT6799W MBG967W MT6179W MT6335WP Product Specifications Brand: AMAOE Model: MT6799W Stencil Thickness: 0.12 mm Product Type: CPU BGA Reballing Stencil Application: Mobile motherboard repair and IC reballing Usage Note: Confirm the chip marking and stencil aperture layout before use to ensure compatibility with the target IC...

AMAOE MT6835V 0.12mm CPU BGA Reballing Stencil The AMAOE MT6835V is a 0.12mm CPU BGA reballing stencil designed for the MediaTek Dimensity 6100+ processor. It is suitable for CPU reballing and chip-level motherboard repair. The stencil provides the required aperture pattern for MT6835V CPU reballing and accurate solder ball placement. Brand AMAOE Model MT6835V Compatible CPU MediaTek Dimensity 6100+ (MT6835V) Thickness 0.12mm Type CPU BGA Reballing Stencil Package 1 × Stencil..