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AMAOE BGA315 0.12mm Hard Drive NAND BGA Reballing Stencil The AMAOE BGA315 is a 0.12mm Hard Drive NAND BGA reballing stencil designed for iPhone 14 repair work. It is used for accurately placing solder balls on the BGA315 NAND during hard drive reballing and motherboard repair. The stencil provides the required BGA315 pattern for NAND chip reballing, helping technicians maintain accurate solder ball placement during the repair process. Product Details Brand AMAOE Model BGA315 Compatible With iPhone 14 Chip BGA315 NAND / Hard Drive Thickness 0.12mm Application Hard Drive NAND BGA Reballing Suitable for: iPhone 14 BGA315 NAND / Hard Drive reballing and motherboard repair...

The AMAOE EMMC-3 0.15mm Multi-IC BGA Reballing Stencil is designed for reballing a wide range of memory IC packages used in mobile and electronic repair. It supports eMMC, eMCP, UFS, uMCP, LPDDR, NAND and PCIe memory IC applications with multiple BGA layouts. Brand AMAOE Model EMMC-3 Application eMMC / eMCP / UFS / uMCP / LPDDR / NAND / PCIe Memory IC Reballing Supported BGA BGA60, BGA70, BGA110, BGA153, BGA162, BGA169, BGA178, BGA186, BGA200, BGA221, BGA254, BGA297 & BGA315 Thickness 0.15mm Type Multi-IC BGA Reballing Stencil Package 1 × Stencil..

AMAOE SSD-1 BGA Reballing Stencil is designed for reballing and solder paste application on compatible SSD, NAND flash memory and U-Disk controller ICs. It helps technicians apply solder paste accurately to the chip's contact pads during chip-level repair and rework. Key Features Multi-size stencil for compatible BGA memory IC packages. Designed for SSD, NAND flash memory and U-Disk IC repair. Supports precise solder paste application during rework. Suitable for electronics motherboard and memory chip servicing. Supported BGA Sizes BGA100 BGA132 BGA136 BGA152 BGA272 BGA316 Applications SSD controller IC reballing NAND flash memory chip repair U-Disk memory IC rework Compatible BGA chip solder paste application Important: Confirm the chip's package layout and stencil markings before use. This stencil is intended for solder paste application; follow the manufacturer's recommended rework method...