Search

AMAOE 0.10mm Magnetic BGA Reballing Stencil for MacBook A1707-T1-343S00136 Model-specific BGA reballing stencil designed for MacBook A1707-T1-343S00136. The AMAOE 0.10mm Magnetic BGA Reballing Stencil is designed specifically for the MacBook A1707-T1-343S00136 and is intended for BGA reballing work during motherboard repair. Product Features Designed for MacBook A1707-T1-343S00136 Suitable for BGA reballing applications 0.10mm stencil thickness Magnetic stencil design Compatibility Compatible Model: MacBook A1707-T1-343S00136 Specifications Brand AMAOE Model A1707-T1-343S00136 Type Magnetic BGA Reballing Stencil Compatible Model MacBook A1707-T1-343S00136 Thickness 0.10mm..

AMAOE 0.12mm BGA Reballing Stencil for Dimensity 8100 Max MT6895Z Lower Layer Model-specific lower-layer BGA reballing stencil for MediaTek Dimensity 8100 Max MT6895Z. The AMAOE 0.12mm BGA Reballing Stencil is designed for MediaTek Dimensity 8100 Max (MT6895Z) lower-layer reballing applications. It is intended for IC and motherboard repair work where reballing of the corresponding BGA package is required. Product Features MT6895Z Compatible – Designed for the MediaTek Dimensity 8100 Max. Lower Layer Stencil – Intended specifically for lower-layer BGA reballing work. 0.12mm Thickness – Product thickness specified for this stencil. BGA Reballing – Suitable for professional IC and motherboard repair applications. Compatibility Compatible Chip: MediaTek Dimensity 8100 Max (MT6895Z) Application: Lower Layer BGA Reballing Specifications Brand AMAOE Model MT6895Z Compatible Chip Dimensity 8100 Max Type BGA Reballing Stencil Application Lower Layer Thickness 0.12mm Package Includes 1 × AMAOE MT6895Z BGA Reballing Stencil..

The AMAOE Middle Layer BGA Reballing Stencil is designed for motherboard middle-layer soldering work on the Samsung Galaxy S20 Ultra G988B/BR. It helps technicians align solder paste or solder balls with the corresponding pad pattern when repairing and reassembling the separated motherboard layers. Product Specifications Brand: AMAOE Product Type: Middle Layer BGA Reballing Stencil Thickness: 0.12mm Compatible Device: Samsung Galaxy S20 Ultra Model Compatibility: G988B / G988BR Application: Motherboard middle-layer soldering and rework Package Contents: 1 × Middle Layer Stencil Usage: Match the stencil pattern with the motherboard's middle-layer solder pad layout before starting rework. Confirm the board model and pattern compatibility before use...

The AMAOE Middle Layer BGA Reballing Stencil is designed for middle-layer motherboard repair on the Samsung Galaxy S20 Ultra G988U. It helps technicians reproduce the solder-pad pattern when reworking and reassembling separated motherboard layers. Specifications Brand: AMAOE Product Type: Middle Layer BGA Reballing Stencil Compatible Device: Samsung Galaxy S20 Ultra Model: G988U Thickness: 0.12mm Application: Motherboard middle-layer soldering and rework Package Contents: 1 × Stencil Usage: Align the stencil with the matching motherboard pad pattern before reballing. Confirm the board model and stencil pattern before starting repair work...

AMAOE 1+10P 0.12mm Middle Layer BGA Reballing Stencil for OnePlus 10 Pro Model-specific middle layer BGA reballing stencil designed for OnePlus 10 Pro motherboard repair. The AMAOE 1+10P Middle Layer BGA Reballing Stencil is specifically designed for the OnePlus 10 Pro. It is used for middle-layer BGA reballing work during motherboard and IC repair. The stencil has a 0.12mm thickness and a 70 × 70mm size, making it suitable for the corresponding OnePlus 10 Pro middle-layer reballing application. Key Features OnePlus 10 Pro Compatible – Designed specifically for OnePlus 10 Pro motherboard repair. Middle Layer BGA Reballing – Suitable for middle-layer BGA reballing applications. 0.12mm Thickness – Model-specific stencil thickness. 70 × 70mm Size – Size specified for the 1+10P version. AMAOE 1+10P – Model-specific reballing stencil. Compatibility Compatible Model: OnePlus 10 Pro This 1+10P stencil is intended for the OnePlus 10 Pro. Please make sure the model matches your repair requirement before ordering. Specifications Brand AMAOE Model 1+10P Type Middle Layer BGA Reballing Stencil Compatible Model OnePlus 10 Pro Thickness 0.12mm Size 70 × 70mm Package Includes 1 × AMAOE 1+10P Middle Layer BGA Reballing Stencil..

AMAOE 1+11 0.12mm Middle Layer BGA Reballing Stencil The AMAOE 1+11 is a 0.12mm middle layer BGA reballing stencil designed for the OnePlus 11. It is used for middle-layer reballing work during motherboard and IC repair. The stencil provides the required hole pattern for solder ball placement on the middle layer, making it suitable for BGA reballing work. Brand AMAOE Model 1+11 Compatible Device OnePlus 11 Thickness 0.12mm Type Middle Layer BGA Reballing Stencil Size 70 × 70mm..

AMAOE 1+9 Pro Middle Layer BGA Reballing Stencil The AMAOE 1+9 Pro is a middle-layer BGA reballing stencil designed for motherboard repair on the OnePlus 9 Pro. It is used by mobile repair technicians during solder-ball rework on compatible motherboard middle-layer layouts. Product Features Designed for OnePlus 9 Pro middle-layer motherboard reballing. Helps position solder balls for compatible BGA pad layouts. Suitable for professional mobile phone motherboard repair work. Compatibility OnePlus 9 Pro (1+9 Pro) Note: Confirm the motherboard layout and stencil alignment before use...

AMAOE BGA316 0.15mm BGA Reballing Stencil The AMAOE BGA316 is a 0.15mm BGA reballing stencil designed for precise solder ball placement during chip-level BGA reballing and repair work. Brand AMAOE Model BGA316 Thickness 0.15mm Type BGA Reballing Stencil Package 1 × Stencil..

AMAOE DDR BGA78 BGA Reballing Stencil The AMAOE DDR BGA78 is a BGA reballing stencil designed for DDR BGA78 IC chip reballing and soldering work. It helps position solder balls during the reballing process. Brand AMAOE Model DDR BGA78 Application DDR BGA78 IC reballing Type BGA Reballing Stencil..

AMAOE G977-010 is a 0.10mm middle-layer BGA reballing stencil designed for the Samsung Galaxy S10 5G G977 series motherboard. It is used to recreate the solder points on the intermediate layer of the layered motherboard during board separation, repair and reassembly. Model: G977-010 Thickness: 0.10mm Compatible Device: Samsung Galaxy S10 5G Compatible Board Series: G977 Compatible Variants: G977U / G977R / G977T / G977P Product Type: Middle Layer BGA Reballing Stencil Application: Motherboard middle-layer solder point rework and reassembly Size: 70 × 70mm Package: 1 × Stencil This stencil is for the middle-layer motherboard soldering process and is not a CPU or individual IC reballing stencil...

AMAOE MI10 is a 0.12mm BGA reballing stencil designed for CPU, RAM and compatible BGA IC reballing on Xiaomi and Redmi smartphone motherboards. It is associated with the Qualcomm SM7150 and SM8150 platforms and is suitable for precision solder-ball placement during IC repair. The stencil is suitable for applications involving Redmi K20, Redmi K20 Pro and Xiaomi Mi 9, with compatibility based on the corresponding SM7150/SM8150 chipset and IC pattern. It can also be used for compatible Qualcomm platform ICs such as PM7150 and PM8150 series components, depending on the stencil pattern. Brand AMAOE Model MI10 / MI-10 Stencil Thickness 0.12mm Type BGA Reballing Stencil Platform Qualcomm SM7150 / SM8150 Compatible Devices Redmi K20, Redmi K20 Pro, Xiaomi Mi 9 Applications CPU, RAM & BGA IC Reballing Package 1 × AMAOE MI10 BGA Stencil The 0.12mm stencil provides the required pad pattern for reballing work and is intended for professional mobile motherboard and micro-soldering applications...

AMAOE MI11 is a 0.12mm BGA reballing stencil designed for CPU, RAM and other BGA IC reballing work on Xiaomi and Redmi motherboards. It provides the required solder-ball pattern for precise IC reballing and motherboard repair. The MI11 stencil supports multiple IC patterns including SM6125, SDM710, MT6785V and other compatible components. It is associated with Xiaomi CC9, CC9e, Mi 8 SE, Mi A3 and Redmi Note 8 series devices. Compatibility should be matched according to the IC or processor code before use. Brand AMAOE Model MI11 / MI-11 Thickness 0.12mm Type BGA Reballing Stencil IC / CPU Support SM6125, SDM710, MT6785V and compatible IC patterns Compatible Devices Xiaomi CC9, CC9e, Mi 8 SE, Mi A3, Redmi Note 8 and compatible models Application CPU, RAM & BGA IC Reballing Package 1 × Stencil The 0.12mm stencil is intended for professional mobile motherboard repair, IC reballing and microsoldering applications...

AMAOE MI12 is a 0.12mm BGA reballing stencil designed for Snapdragon 865 (SM8250) CPU reballing and motherboard repair. It is suitable for compatible Xiaomi and Redmi devices, including Xiaomi Mi 10, Mi 10 Pro and Redmi K30 Pro. The stencil provides a precise solder-ball pattern for reballing compatible CPU chips during mobile motherboard repair. Its 0.12mm thickness is intended for professional BGA rework and microsoldering applications. Brand AMAOE Model MI12 Thickness 0.12mm Type CPU BGA Reballing Stencil CPU Qualcomm Snapdragon 865 (SM8250) Compatible Devices Xiaomi Mi 10, Xiaomi Mi 10 Pro, Redmi K30 Pro Application CPU BGA Reballing and Mobile Motherboard Repair Package 1 × Stencil..

AMAOE MI13 is a 0.12mm multi-IC BGA reballing stencil designed for compatible CPU and IC reballing applications. It supports MediaTek MT6769V and Qualcomm SM6115 / SM7225 platforms and is used for motherboard repair and BGA IC reballing. Model: MI13 Thickness: 0.12mm Main CPU Platforms: MT6769V / SM6115 / SM7225 Chipsets: MediaTek MT6769V, Snapdragon 662, Snapdragon 750G BGA Pattern: BGA254 Compatible Devices: Redmi 9, Redmi Note 9, Redmi Note 9 4G, Redmi Note 9 Pro 5G and other compatible devices using the supported CPU platforms Application: CPU and BGA IC Reballing Material: Japanese Steel Sheet Hole Type: Square Reusable: Yes Package: 1 × Stencil..

AMAOE MI14 is a 0.12mm BGA reballing stencil designed for Qualcomm SM8350 / Snapdragon 888 CPU and RAM reballing. It is compatible with Xiaomi Mi 11 series and Redmi K40 Pro and includes multiple BGA patterns for CPU, RAM and supporting IC reballing. Model: MI14 Thickness: 0.12mm Main CPU: Qualcomm SM8350 / Snapdragon 888 CPU Pattern: SM8350 CPU RAM Pattern: SM8350 RAM BGA Pattern: BGA153 Supporting IC Patterns: PM8350BH-001, PM8350/C, QMP5679, SMB1396, WCD9380, WCN6851 Compatible Devices: Xiaomi Mi 11, Mi 11 Pro, Mi 11 Ultra, Mi 11i, Mi 11X Pro, Redmi K40 Pro Application: CPU, RAM and BGA IC Reballing Package: 1 × Stencil..

AMAOE MI15 is a 0.12mm BGA reballing stencil designed for CPU reballing and mobile motherboard repair. It is intended for compatible Qualcomm processors used in selected Xiaomi and Redmi smartphones. This stencil is listed for Xiaomi 12, Xiaomi 12 Pro, Xiaomi 12X and Redmi K50 eSports Edition. It supports the specified Qualcomm SM8450 and SM8250 BGA patterns. Check the processor marking and stencil pattern before use to ensure compatibility. Brand AMAOE Model MI15 Thickness 0.12mm Type CPU BGA Reballing Stencil Supported Chipsets Qualcomm SM8450 / SM8250 Compatible Devices Xiaomi 12, Xiaomi 12 Pro, Xiaomi 12X, Redmi K50 eSports Edition Application CPU BGA Reballing and Mobile Motherboard Repair Package 1 × Stencil The stencil is intended for professional BGA rework, CPU reballing and microsoldering applications. It helps position solder balls in the required pattern during IC reballing...

AMAOE MI16 is a 0.12mm CPU BGA reballing stencil designed for MediaTek Dimensity 8100 and Dimensity 9000 processor platforms. It supports MT6895Z and MT6983Z CPU layouts and is suitable for CPU, RAM and supporting IC reballing during Xiaomi and Redmi motherboard repair. Model: MI16 Thickness: 0.12mm CPU Platforms: MediaTek Dimensity 8100 / Dimensity 9000 Chip Codes: MT6895Z / MT6983Z Compatible Devices: Redmi K50, Redmi K50 Pro, Redmi Note 11 Pro, Redmi Note 11 Pro+, Xiaomi 12 Pro Dimensity Edition Supported Patterns: CPU, RAM, BGA153 and multiple supporting IC layouts Application: CPU, RAM and BGA IC Reballing Package: 1 × Stencil The stencil is designed to match the BGA pad layout of the supported processor and memory packages for accurate solder-ball placement during reballing work...

AMAOE MI17 is a 0.12mm CPU BGA reballing stencil designed for mobile motherboard repair. It is intended for reballing compatible MediaTek Dimensity processors used in selected Redmi smartphones. The stencil is listed for Redmi Note 12 Pro and Redmi Note 12 Pro+ models with supported Dimensity 810, Dimensity 1100 and Dimensity 1200 CPU patterns. Before use, check the processor model and stencil pattern to ensure compatibility. Brand AMAOE Model MI17 Thickness 0.12mm Type CPU BGA Reballing Stencil Supported Processors MediaTek Dimensity 810 / 1100 / 1200 Compatible Devices Redmi Note 12 Pro / Redmi Note 12 Pro+ Application CPU Reballing and Mobile Motherboard Repair Package 1 × Stencil The 0.12mm stencil provides the required solder-ball layout for compatible CPU reballing work. It is intended for professional BGA rework and microsoldering applications...

AMAOE MI18 is a 0.12mm CPU BGA reballing stencil designed for the JLQ JR510 processor used in the POCO C40. It is part of the Universal Series and is intended for professional mobile motherboard IC reballing and repair. The MI18 is designed around the JR510 CPU pattern and can also be used for compatible IC reballing patterns provided on the stencil. It is suitable for POCO C40 motherboard repair and BGA reballing work. Brand AMAOE Model MI18 / MI-18 Thickness 0.12mm Type CPU Universal Series BGA Reballing Stencil CPU JLQ JR510 Compatible Device POCO C40 Application CPU & BGA IC Reballing, Mobile Motherboard Repair Package 1 × Stencil The 0.12mm stencil provides the required aperture pattern for controlled solder-ball placement during CPU and IC reballing. Check the IC marking and stencil pattern before use to ensure compatibility...

AMAOE MI19 is a 0.12mm BGA reballing stencil designed for Qualcomm Snapdragon 8 Gen 2 / SM8550 CPU reballing. It is suitable for Xiaomi 13 Series motherboard repair and CPU BGA reballing applications. Model: MI19 Thickness: 0.12mm CPU: Snapdragon 8 Gen 2 / SM8550 Compatible Series: Xiaomi 13 Series Application: CPU BGA Reballing Package: 1 × Stencil..

AMAOE MI6 is a 0.12mm BGA reballing stencil designed for Qualcomm Snapdragon 636 and Snapdragon 660 IC reballing. It is suitable for motherboard repair and BGA reballing applications on compatible Xiaomi and Redmi devices. Model: MI6 Thickness: 0.12mm Compatible CPUs: Qualcomm Snapdragon 636 / Snapdragon 660 Compatible Devices: Xiaomi Mi Note 3, Xiaomi Mi 6X, Redmi Note 5, Redmi Note 5 Pro Application: BGA IC Reballing Package: 1 × Stencil..

AMAOE MI7 is a 0.12mm CPU BGA reballing stencil designed for Qualcomm MSM8953 and MSM8917 processors. MSM8953 corresponds to Snapdragon 625, while MSM8917 corresponds to Snapdragon 425. The stencil is suitable for CPU reballing and motherboard repair on compatible Xiaomi and Redmi devices. Specifications: Model: MI7 Thickness: 0.12mm Compatible CPU: Qualcomm MSM8953 / MSM8917 Chipsets: Snapdragon 625 / Snapdragon 425 Compatible Devices: Redmi Note 4X, Redmi 4, Redmi 4A, Redmi 5A, Redmi 5 Plus, Redmi S2, Xiaomi Mi 5X and Mi Max 2 Application: CPU BGA Reballing and Motherboard Repair Package: 1 × Stencil For best compatibility, match the processor code on the motherboard with MSM8953 or MSM8917 before using the stencil...

AMAOE MI8 is a 0.12mm CPU BGA reballing stencil designed for Qualcomm MSM8996 processor reballing. It is compatible with Xiaomi Mi 5, Mi 5S, Mi 5S Plus, Mi Note 2 and Mi MIX, making it suitable for CPU IC reballing and motherboard repair work. Model: MI8 Thickness: 0.12mm CPU: Qualcomm MSM8996 Compatible Devices: Xiaomi Mi 5, Mi 5S, Mi 5S Plus, Mi Note 2, Mi MIX Application: CPU BGA Reballing and Motherboard Repair Package: 1 × Stencil..

AMAOE MI9 is a 0.12mm CPU BGA reballing stencil designed for Qualcomm Snapdragon 845 (SDM845) and Snapdragon 710 (SDM710) processor reballing. It is compatible with Xiaomi Mi 8, Mi 8 SE and Mi MIX 2S for motherboard repair and CPU BGA reballing applications. Model: MI9 Thickness: 0.12mm Compatible CPUs: Qualcomm Snapdragon 845 / Snapdragon 710 CPU Codes: SDM845 / SDM710 Compatible Devices: Xiaomi Mi 8, Mi 8 SE, Mi MIX 2S Application: CPU BGA Reballing and Motherboard Repair Package: 1 × Stencil..

The AMAOE Middle Layer BGA Reballing Stencil is designed for motherboard middle-layer repair and solder-pad rework on compatible Samsung Galaxy Z Flip devices. Check your device model carefully before selecting this stencil. Product Details Brand: AMAOE Product Type: Middle Layer BGA Reballing Stencil Compatible Models: Samsung SM-F700F / SM-F700U Application: Motherboard middle-layer soldering and rework Important: Confirm that your phone's model number is SM-F700F or SM-F700U before ordering. This listing is for a middle-layer stencil; it is not a complete repair service or motherboard...

The AMAOE MP1 Power IC BGA Reballing Stencil is designed to assist with solder-ball placement and reballing of compatible power management ICs (PMICs) during mobile motherboard repair. It supports the IC models listed below. Supported IC Models Qualcomm Power ICs PM660, PM660A, PM670, PM845, PM540, PM640 MediaTek Power ICs MT6358W, MT6356W, MT6355W, MT6357V, MT6357CRV Product Specifications Brand: AMAOE Model: MP-1 Product Type: Power IC BGA Reballing Stencil Thickness: 0.12 mm Application: Power IC solder-ball rework and reballing Package Contents: 1 × BGA stencil Important: Check the IC model printed on your component and match it with the supported list before use. This stencil is intended for compatible IC layouts; it is not a power IC or a complete repair kit...

The AMAOE MP2 Power IC BGA Reballing Stencil is designed for reballing compatible power management ICs (PMICs) used in Qualcomm and MediaTek mobile devices. Its 0.12mm stencil plate helps technicians apply solder through the matching BGA pad pattern during motherboard repair. Supported IC Models PM7250 / PM7250B PMX55 PM6350 / PM7150A PM4250 / PM6225 PM7325 / PM7325B / PM7350C PM8250 PM8350 / PM8350BH / PM8350C PM8450 MT6359VPP MT6635XP MT6365VMW MT6360P / MT6360MP / MT6360RP Product Specifications Brand: AMAOE Model: MP2 Thickness: 0.12mm Product Type: Power IC BGA Reballing Stencil Compatible Platforms: Qualcomm and MediaTek Application: Power IC solder-ball rework and motherboard repair Package Contents: 1 × BGA reballing stencil Important: Check the exact IC marking and compare its BGA layout with the stencil before use. Compatibility depends on the IC package and pad pattern, not just the phone brand or processor platform...

The AMAOE MQ-1 CPU BGA Reballing Stencil is designed for reballing compatible Qualcomm and MediaTek (MTK) CPU chips during mobile motherboard repair. The 0.12mm stencil helps align the solder-ball pattern with the matching IC layout. Supported IC Models Qualcomm SDM710 SDM845 A / SDM845 B SDM660 SDM845 RAM layout MediaTek (MTK) MT6771V MT6739V MT6763V MT6757V Product Specifications Brand: AMAOE Model: MQ-1 Thickness: 0.12mm Product Type: CPU BGA Reballing Stencil Compatible Platforms: Qualcomm and MediaTek Application: CPU and compatible RAM BGA reballing Package Contents: 1 × MQ-1 stencil Important: Confirm the exact IC marking and match its pad layout with the stencil before use. Compatibility depends on the chip layout, not just the phone model...

The AMAOE MQ-2 CPU BGA Reballing Stencil is designed for reballing compatible Qualcomm and MediaTek (MTK) processor ICs during mobile motherboard repair. It helps technicians align solder-ball placement with the matching BGA pad pattern. Supported IC Models MediaTek (MTK) MT6779V MT6768 MT6765 Qualcomm SDM439 MSM8909W Product Specifications Brand: AMAOE Model: MQ-2 Product Type: CPU BGA Reballing Stencil Compatible Platforms: Qualcomm and MediaTek Application: CPU BGA reballing and motherboard-level repair Package Contents: 1 × AMAOE MQ-2 stencil Important: Confirm the exact IC marking and match its BGA pad layout with the stencil before use. Compatibility depends on the chip package and stencil pattern...

The AMAOE MQ-3 CPU BGA Reballing Stencil is designed for reballing compatible processor ICs during mobile motherboard repair. It helps technicians align solder-ball placement with the corresponding BGA pad pattern. Supported IC Models Qualcomm Snapdragon 865 (SM8250) Qualcomm SM7250 Qualcomm SM7150 Qualcomm SM6150 MediaTek MT6885Z Product Specifications Brand: AMAOE Model: MQ-3 Product Type: CPU BGA Reballing Stencil Compatible Platforms: Qualcomm and MediaTek Application: CPU BGA reballing and motherboard repair Package Contents: 1 × AMAOE MQ-3 stencil Important: Check the exact IC marking and match the BGA pad layout with the stencil before use. Compatibility depends on the chip package and stencil pattern. This product listing is for the stencil only...