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AMAOE 26×26mm 0.30mm Universal BGA Reballing Stencil The AMAOE Universal BGA Reballing Stencil measures 26×26mm and has a 0.30mm thickness with 1.27mm spacing. It is designed for universal BGA reballing applications. Brand AMAOE Size 26×26mm Thickness 0.30mm Spacing 1.27mm Type Universal BGA Reballing Stencil..

AMAOE 50×50mm 0.30mm Universal BGA Reballing Stencil The AMAOE Universal BGA Reballing Stencil measures 50×50mm and has a 0.30mm thickness with 1.0mm spacing. It is designed for universal BGA reballing applications. Brand AMAOE Size 50×50mm Thickness 0.30mm Spacing 1.0mm Type Universal BGA Reballing Stencil..

AMAOE Universal BGA Reballing Stencil The AMAOE Universal BGA Reballing Stencil is a multi-function stencil designed for mobile phone motherboard repair. It supports multiple solder ball pitches, making it useful for technicians working with compatible BGA chips during chip-level repairs. Key Features. Supports 0.3 mm, 0.35 mm, 0.4 mm and 0.5 mm solder ball pitches Includes parallel-hole and 45-degree hole patterns Suitable for compatible CPU, eMMC, UFS and power IC reballing Square-hole design for solder ball placement Reusable stainless steel construction Specifications: Brand AMAOE, multi-function universal stencil, 0.12 mm thickness. Note: Choose the correct hole pattern and solder ball size for the IC package before reballing...