AMAOE EMMC-2 0.15mm BGA Reballing Stencil for eMMC, eMCP & UFS

AMAOE EMMC-2 0.15mm BGA Reballing Stencil for eMMC, eMCP & UFS

β‚Ή199.00
Brand:
Model: EMMC-2
Availability: In Stock
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Product Description

The AMAOE EMMC-2 0.15mm BGA Reballing Stencil is designed for eMMC, eMCP and UFS memory IC reballing applications. It is suitable for chip-level repair work where accurate solder ball placement is required.

Brand AMAOE
Model EMMC-2
Compatibility eMMC / eMCP / UFS Memory IC
Thickness 0.15mm
Type Memory IC BGA Reballing Stencil
Package 1 Γ— Stencil

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