AMAOE Middle Layer BGA Reballing Stencil for Samsung Galaxy Z Flip F700F/F700U

Name: AMAOE Middle Layer BGA Reballing Stencil for Samsung Galaxy Z Flip F700F/F700U
Brand: AMAOE
SKU: SM-F700F
Availability: InStock

₹249.00

Brand: AMAOE

Model: SM-F700F

Availability: In Stock

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Tags: Samsung Z Flip Middle Layer BGA Stencil

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Description
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Product Description

The AMAOE Middle Layer BGA Reballing Stencil is designed for motherboard middle-layer repair and solder-pad rework on compatible Samsung Galaxy Z Flip devices. Check your device model carefully before selecting this stencil.

Product Details

Brand: AMAOE
Product Type: Middle Layer BGA Reballing Stencil
Compatible Models: Samsung SM-F700F / SM-F700U
Application: Motherboard middle-layer soldering and rework

Important: Confirm that your phone's model number is SM-F700F or SM-F700U before ordering. This listing is for a middle-layer stencil; it is not a complete repair service or motherboard.

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📦 Estimated Delivery Time

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✈️ Shipping Time

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🌍 Important Note

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