AMAOE MI9 is a 0.12mm CPU BGA reballing stencil designed for Qualcomm Snapdragon 845 (SDM845) and Snapdragon 710 (SDM710) processor reballing. It is compatible with Xiaomi Mi 8, Mi 8 SE and Mi MIX 2S for motherboard repair and CPU BGA reballing applications. Model: MI9 Thickness: 0.12mm Compatible CPUs: Qualcomm Snapdragon 845 / Snapdragon 710 CPU Codes: SDM845 / SDM710 Compatible Devices: Xiaomi Mi 8, Mi 8 SE, Mi MIX 2S Application: CPU BGA Reballing and Motherboard Repair Package: 1 × Stencil

The AMAOE Middle Layer BGA Reballing Stencil is designed for motherboard middle-layer repair and solder-pad rework on compatible Samsung Galaxy Z Flip devices. Check your device model carefully before selecting this stencil. Product Details Brand: AMAOE Product Type: Middle Layer BGA Reballing Stencil Compatible Models: Samsung SM-F700F / SM-F700U Application: Motherboard middle-layer soldering and rework Important: Confirm that your phone's model number is SM-F700F or SM-F700U before ordering. This listing is for a middle-layer stencil; it is not a complete repair service or motherboard.

The AMAOE MP1 Power IC BGA Reballing Stencil is designed to assist with solder-ball placement and reballing of compatible power management ICs (PMICs) during mobile motherboard repair. It supports the IC models listed below. Supported IC Models Qualcomm Power ICs PM660, PM660A, PM670, PM845, PM540, PM640 MediaTek Power ICs MT6358W, MT6356W, MT6355W, MT6357V, MT6357CRV Product Specifications Brand: AMAOE Model: MP-1 Product Type: Power IC BGA Reballing Stencil Thickness: 0.12 mm Application: Power IC solder-ball rework and reballing Package Contents: 1 × BGA stencil Important: Check the IC model printed on your component and match it with the supported list before use. This stencil is intended for compatible IC layouts; it is not a power IC or a complete repair kit.

The AMAOE MP2 Power IC BGA Reballing Stencil is designed for reballing compatible power management ICs (PMICs) used in Qualcomm and MediaTek mobile devices. Its 0.12mm stencil plate helps technicians apply solder through the matching BGA pad pattern during motherboard repair. Supported IC Models PM7250 / PM7250B PMX55 PM6350 / PM7150A PM4250 / PM6225 PM7325 / PM7325B / PM7350C PM8250 PM8350 / PM8350BH / PM8350C PM8450 MT6359VPP MT6635XP MT6365VMW MT6360P / MT6360MP / MT6360RP Product Specifications Brand: AMAOE Model: MP2 Thickness: 0.12mm Product Type: Power IC BGA Reballing Stencil Compatible Platforms: Qualcomm and MediaTek Application: Power IC solder-ball rework and motherboard repair Package Contents: 1 × BGA reballing stencil Important: Check the exact IC marking and compare its BGA layout with the stencil before use. Compatibility depends on the IC package and pad pattern, not just the phone brand or processor platform.

The AMAOE MQ-1 CPU BGA Reballing Stencil is designed for reballing compatible Qualcomm and MediaTek (MTK) CPU chips during mobile motherboard repair. The 0.12mm stencil helps align the solder-ball pattern with the matching IC layout. Supported IC Models Qualcomm SDM710 SDM845 A / SDM845 B SDM660 SDM845 RAM layout MediaTek (MTK) MT6771V MT6739V MT6763V MT6757V Product Specifications Brand: AMAOE Model: MQ-1 Thickness: 0.12mm Product Type: CPU BGA Reballing Stencil Compatible Platforms: Qualcomm and MediaTek Application: CPU and compatible RAM BGA reballing Package Contents: 1 × MQ-1 stencil Important: Confirm the exact IC marking and match its pad layout with the stencil before use. Compatibility depends on the chip layout, not just the phone model.

The AMAOE MQ-2 CPU BGA Reballing Stencil is designed for reballing compatible Qualcomm and MediaTek (MTK) processor ICs during mobile motherboard repair. It helps technicians align solder-ball placement with the matching BGA pad pattern. Supported IC Models MediaTek (MTK) MT6779V MT6768 MT6765 Qualcomm SDM439 MSM8909W Product Specifications Brand: AMAOE Model: MQ-2 Product Type: CPU BGA Reballing Stencil Compatible Platforms: Qualcomm and MediaTek Application: CPU BGA reballing and motherboard-level repair Package Contents: 1 × AMAOE MQ-2 stencil Important: Confirm the exact IC marking and match its BGA pad layout with the stencil before use. Compatibility depends on the chip package and stencil pattern.

The AMAOE MQ-3 CPU BGA Reballing Stencil is designed for reballing compatible processor ICs during mobile motherboard repair. It helps technicians align solder-ball placement with the corresponding BGA pad pattern. Supported IC Models Qualcomm Snapdragon 865 (SM8250) Qualcomm SM7250 Qualcomm SM7150 Qualcomm SM6150 MediaTek MT6885Z Product Specifications Brand: AMAOE Model: MQ-3 Product Type: CPU BGA Reballing Stencil Compatible Platforms: Qualcomm and MediaTek Application: CPU BGA reballing and motherboard repair Package Contents: 1 × AMAOE MQ-3 stencil Important: Check the exact IC marking and match the BGA pad layout with the stencil before use. Compatibility depends on the chip package and stencil pattern. This product listing is for the stencil only.

The AMAOE MQ-4 CPU BGA Reballing Stencil is designed for reballing compatible Qualcomm and MediaTek ICs during mobile motherboard repair. Its 0.12mm stencil plate helps align solder-ball placement with the corresponding BGA layout. Supported IC Models Qualcomm SM8350 — Snapdragon 888 SM8450 — Snapdragon 8 Gen 1 SM7315 — Snapdragon 778G SM7325 — Snapdragon 778G+ MediaTek (MTK) MT6833V — Dimensity 810 MT6799W MT6877V — Dimensity 900 Product Specifications Brand: AMAOE Model: MQ-4 Thickness: 0.12mm Product Type: CPU BGA Reballing Stencil Compatible Platforms: Qualcomm and MediaTek Application: CPU and supported RAM BGA reballing Package Contents: 1 × AMAOE MQ-4 stencil Important: Check the exact IC marking and match its BGA pad layout with the stencil before use. Some patterns may be intended for RAM rather than CPU chips. This listing includes one stencil.

The AMAOE MQ-5 CPU BGA Reballing Stencil is designed for professional mobile phone motherboard repair and CPU reballing work. It helps technicians position solder balls accurately when working with compatible BGA chip packages. Key Features Designed for CPU BGA reballing and chip-level motherboard repair. Supports selected Qualcomm and MediaTek processor packages. Helps maintain accurate solder-ball placement during reballing. Suitable for mobile phone repair technicians and electronics workshops. Compatible IC Models MediaTek: MT6859Z, MT6983Z, MT8176V Qualcomm: SM8475, SM6225, SM7450, SM8550 RAM marking listed by supplier: RAM496 Product Specifications Brand: AMAOE Model: MQ-5 Product Type: CPU BGA Reballing Stencil Application: Mobile motherboard and IC repair Note: Confirm the chip marking and stencil layout before use to ensure compatibility with the target processor.

The AMAOE MQ-6 CPU BGA Reballing Stencil is designed for mobile phone motherboard repair and CPU reballing applications. It helps technicians align solder balls with the BGA pad layout when servicing compatible processor packages. Key Features Designed for CPU BGA reballing and chip-level repair. Supports selected Qualcomm and MediaTek IC packages. Helps achieve consistent solder-ball placement during reballing. Suitable for mobile repair technicians and electronics workshops. Compatible IC Models Qualcomm: SM6450, SM8650, SM4450 MediaTek: MT6985W, MT6781V, MT6879, MT8781V Specifications Brand: AMAOE Model: MQ-6 Type: CPU BGA Reballing Stencil Application: Mobile motherboard and IC repair Note: Check the processor marking and stencil aperture layout before use to confirm compatibility.

The AMAOE MT-1 MediaTek Power IC Reballing Stencil is designed for mobile phone motherboard repair and power IC reballing. It helps technicians position solder balls according to the compatible IC's BGA layout during chip-level repair. Key Features Designed for MediaTek power IC BGA reballing. Suitable for compatible IC rework and motherboard repair. Helps maintain accurate solder-ball placement. Useful for mobile repair technicians and electronics workshops. Compatible IC Models MT6311P MT6158A MT6165V MT6350V MT6329A MT6320 MT6175V MT6328V MT6351V Product Specifications Brand: AMAOE Model: MT-1 Product Type: MediaTek Power IC BGA Reballing Stencil Application: Mobile motherboard repair and IC reballing Usage Note: Check the IC marking and stencil hole pattern before starting reballing to ensure compatibility. Stencil thickness and package contents should be confirmed with the supplier.

The AMAOE MT-2 Power IC BGA Reballing Stencil is designed for mobile phone motherboard repair and MediaTek power IC reballing. It helps technicians align solder balls with the compatible IC package layout during chip-level repair. Key Features Designed for MediaTek power IC BGA reballing. Suitable for compatible IC rework and motherboard repair. Helps with precise solder-ball placement during reballing. Suitable for mobile repair technicians and electronics workshops. Compatible IC Models MT6356W MT6322 MT6325V MT6329 MT6353V MT6355W Product Specifications Brand: AMAOE Model: MT-2 Product Type: Power IC BGA Reballing Stencil Application: Mobile phone motherboard repair and IC reballing Usage Note: Check the IC marking and stencil hole pattern before use. Stencil thickness and package contents should be confirmed with the supplier.

The AMAOE MT6781V CPU BGA Reballing Stencil is intended for chip-level mobile phone motherboard repair involving compatible MediaTek processor packages. It helps technicians align solder balls with the CPU's BGA pad layout during reballing work. Key Features Designed for CPU BGA reballing applications. Made for compatible MediaTek MT6781V processor layouts. Helps with solder-ball alignment during chip rework. Suitable for mobile phone repair technicians and electronics workshops. Product Specifications Brand: AMAOE IC Model: MT6781V Product Type: CPU BGA Reballing Stencil Application: Mobile motherboard repair and CPU reballing Usage Note: Confirm the processor marking and stencil aperture pattern before use. Stencil thickness and package contents should be verified with the supplier.

The AMAOE MT6799W CPU BGA Reballing Stencil is designed for mobile phone motherboard repair and CPU chip reballing. It helps technicians align solder balls with the compatible BGA package layout during chip-level repair. Key Features Designed for CPU BGA reballing and motherboard repair. Associated with MediaTek Helio X30 and the IC models listed below. Helps maintain accurate solder-ball placement during reballing. Suitable for mobile repair technicians and electronics workshops. Compatible IC Models MT6799W MBG967W MT6179W MT6335WP Product Specifications Brand: AMAOE Model: MT6799W Stencil Thickness: 0.12 mm Product Type: CPU BGA Reballing Stencil Application: Mobile motherboard repair and IC reballing Usage Note: Confirm the chip marking and stencil aperture layout before use to ensure compatibility with the target IC.

AMAOE MT6835V 0.12mm CPU BGA Reballing Stencil The AMAOE MT6835V is a 0.12mm CPU BGA reballing stencil designed for the MediaTek Dimensity 6100+ processor. It is suitable for CPU reballing and chip-level motherboard repair. The stencil provides the required aperture pattern for MT6835V CPU reballing and accurate solder ball placement. Brand AMAOE Model MT6835V Compatible CPU MediaTek Dimensity 6100+ (MT6835V) Thickness 0.12mm Type CPU BGA Reballing Stencil Package 1 × Stencil

AMAOE MT6879V 0.12mm CPU BGA Reballing Stencil The AMAOE MT6879V is a 0.12mm CPU BGA reballing stencil designed for the MediaTek Dimensity 1050 chipset. It is used for accurate solder ball placement during CPU reballing and mobile motherboard repair. The stencil provides the dedicated MT6879V CPU BGA pattern, helping technicians align the solder balls correctly on the chip during the reballing process. Product Details Brand AMAOE Model MT6879V Chipset MediaTek Dimensity 1050 (MT6879V) Stencil Type CPU BGA Reballing Thickness 0.12mm Application CPU BGA Reballing & Mobile Motherboard Repair

AMAOE MT6885Z / MT6889Z 0.12mm Lower Layer BGA Reballing Stencil The AMAOE MT6885Z / MT6889Z is a 0.12mm lower layer BGA reballing stencil for MediaTek Dimensity 1000 / L chip reballing and motherboard repair work. It is designed for accurate solder ball placement on the lower layer of the compatible IC during the BGA reballing process. Product Details Brand AMAOE Model MT6885Z / MT6889Z Compatible Designation Dimensity 1000 / L Type Lower Layer BGA Reballing Stencil Thickness 0.12mm Package 1 × Stencil

AMAOE MT6886V 0.12mm CPU BGA Reballing Stencil The AMAOE MT6886V is a 0.12mm CPU BGA reballing stencil designed for the MediaTek Dimensity 7200 Ultra processor. It is suitable for CPU reballing and chip-level motherboard repair. The stencil provides the required aperture pattern for MT6886V CPU reballing and accurate solder ball placement. Brand AMAOE Model MT6886V Compatible CPU MediaTek Dimensity 7200 Ultra (MT6886V) Thickness 0.12mm Type CPU BGA Reballing Stencil Package 1 × Stencil

AMAOE MT6983Z-9000 0.12mm CPU BGA Reballing Stencil The AMAOE MT6983Z-9000 is a 0.12mm CPU BGA reballing stencil designed for the MediaTek Dimensity 9000 5G chipset. It is used for accurate solder ball placement during CPU reballing and mobile motherboard repair. Product Details Brand AMAOE Model MT6983Z-9000 Chipset MediaTek Dimensity 9000 5G (MT6983Z) Stencil Type CPU BGA Reballing Thickness 0.12mm Application CPU BGA Reballing & Motherboard Repair

AMAOE MT8781 0.12mm CPU BGA Reballing Stencil The AMAOE MT8781 is a dedicated 0.12mm CPU BGA reballing stencil for the MediaTek MT8781 processor. It is designed for CPU reballing and chip-level motherboard repair work. The stencil provides an aperture pattern matched to the MT8781 CPU for accurate solder ball placement during the reballing process. Product Details Brand AMAOE Model MT8781 Compatible CPU MediaTek MT8781 Type CPU BGA Reballing Stencil Thickness 0.12mm Package 1 × Stencil

The AMAOE MU-4 CPU BGA Reballing Stencil is designed for mobile phone motherboard repair and compatible MediaTek processor reballing. It helps technicians align solder balls with the chip's BGA pad layout during chip-level repair. Key Features Designed for MediaTek CPU BGA reballing. Suitable for compatible processor and RAM reballing layouts. Helps with accurate solder-ball placement during repair. Useful for mobile repair technicians and electronics workshops. Compatible IC Models MT6885Z MT6853V MT6768V Product Specifications Brand: AMAOE Model: MU-4 Stencil Thickness: 0.12 mm Product Type: CPU BGA Reballing Stencil Application: Mobile motherboard repair and IC reballing Usage Note: Confirm the exact chip and RAM layout before use. The supplied product title repeats MT6885Z and MT6768V; check the stencil's printed markings or supplier specifications to confirm the supported layouts.

The AMAOE MU1 0.12mm MTK CPU Universal BGA Reballing Stencil is designed for MediaTek CPU reballing and mobile motherboard repair. It supports multiple MTK processor layouts used in compatible smartphones. Key Features Brand: AMAOE Model: MU1 Thickness: 0.12mm Type: Universal MTK CPU BGA reballing stencil Compatible ICs: MT6795W, MT6797W, MT6595, MT6732 and MT6750 Material: Japanese steel sheet, as listed by sellers Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA pad layout during CPU rework. Compatibility Note: Confirm the processor marking and BGA pattern before use to ensure the stencil matches the IC being repaired.

The AMAOE MU2 0.12mm MTK CPU BGA Reballing Stencil is designed for MediaTek processor reballing and mobile motherboard repair. It supports multiple MTK chipset layouts used in compatible smartphones. Key Features Brand: AMAOE Model: MU2 Thickness: 0.12mm Material: Japanese steel sheet Type: MTK CPU BGA reballing stencil Supported Chipsets: MT6582, MT6735, MT6589, MT6572A, MT6580A and MT6755 Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA pad layout during CPU rework. Compatibility Note: Check the processor marking and BGA layout before use to ensure the stencil matches the chip being repaired.

The AMAOE MU3 V5.0 0.12mm MTK CPU BGA Reballing Stencil is designed for MediaTek processor reballing and smartphone motherboard repair. It supports multiple MTK chipset layouts, making it useful for technicians working on compatible devices. Key Features Brand: AMAOE Model: MU3 V5.0 Thickness: 0.12mm Type: MTK CPU BGA reballing stencil Supported Chipsets: MT6260DA, MT6762V, MT6765V, MT6739V, MT6785V, MT6757V, MT6771V, MT6763V, MT6873V and MT6875 Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA pad layout during CPU rework. Compatibility Note: Check the processor marking and BGA layout before use to ensure the stencil matches the chip being repaired.

AMAOE N-9860 is a 0.12mm middle-layer BGA reballing stencil designed specifically for the Samsung Galaxy Note20 Ultra N9860 motherboard. It is used for middle-layer solder ball placement during motherboard separation, repair and reassembly. Model: N-9860 Thickness: 0.12mm Compatible Device: Samsung Galaxy Note20 Ultra Compatible Model: N9860 Product Type: Middle Layer BGA Reballing Stencil Application: Motherboard Middle-Layer Reballing and Repair Package: 1 × Stencil

AMAOE Note20 0.12mm Middle Layer BGA Reballing Stencil The AMAOE Note20 is a 0.12mm middle layer BGA reballing stencil designed for Samsung Galaxy Note20 models SM-N981U, SM-N981N and SM-N9810. It is intended for motherboard IC reballing and repair work. Brand AMAOE Model SM-N981U/N/O Compatibility Samsung Galaxy Note20 SM-N981U / N981N / N9810 Thickness 0.12mm Type Middle Layer BGA Reballing Stencil Package 1 × Stencil

The AMAOE OV-1 0.12mm CPU BGA Reballing Stencil is designed for CPU and motherboard repair on compatible OPPO and VIVO smartphones. It supports the MT6755V and MT6750V processor layouts listed for this stencil. Key Features Brand: AMAOE Model: OV-1 Thickness: 0.12mm Material: Japanese steel sheet Type: CPU BGA reballing stencil Supported Processors: MT6755V and MT6750V Listed Compatible Models: OPPO R9, A59, A37, A3, A3s, A5 and A6; VIVO Y67 and V5 Application: CPU reballing and smartphone motherboard repair The stencil helps align solder balls or solder paste with the matching BGA pad layout during chip rework. Compatibility Note: Confirm the processor marking and BGA pattern before use, as phone variants may differ.

The AMAOE OV-2 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible OPPO and VIVO smartphones using the supported Qualcomm processor layouts. Key Features Brand: AMAOE Model: OV-2 Thickness: 0.12mm Type: CPU BGA reballing stencil Supported Processors: Qualcomm MSM8916, MSM8939 and MSM8940 Compatible Brands: OPPO and VIVO Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA layout during chip rework. Compatibility Note: Verify the processor marking and stencil pattern before use to ensure compatibility with the motherboard being repaired.

The AMAOE OV-3 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible OPPO and VIVO smartphones. It supports the MT6771, MT6763 and SDM660 processor layouts listed for this stencil. Key Features Brand: AMAOE Model: OV-3 Thickness: 0.12mm Type: CPU BGA reballing stencil Supported Processors: MT6771, MT6763 and Qualcomm SDM660 Compatible OPPO Models: A3, A1, A73, A79, A83, R11 and R15 Compatible VIVO Models: X20, X20i and Y75 Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA pad layout during chip rework. Compatibility Note: Confirm the processor marking and BGA pattern before use, as device variants may differ.

The AMAOE OV-4 0.12mm CPU BGA Reballing Stencil is designed for CPU and motherboard IC reballing on compatible OPPO and VIVO smartphones. It supports multiple Qualcomm Snapdragon processor layouts and auxiliary IC patterns. Key Features Brand: AMAOE Model: OV-4 Thickness: 0.12mm Type: CPU and IC BGA reballing stencil Supported Processors: Qualcomm SM6125, SM6150, SM7150 and SDM710 Related Platforms: Snapdragon 665, 675, 730, 730G, 732G and 710 Listed OPPO Models: A11, A11x, A52, K3, K5, Reno, Reno2 and R17 Pro Listed VIVO Models: NEX, S1 Pro, U3x, U10, X27, X27 Pro, Y50, Y9s and Z5x Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA pad layout during chip rework. Compatibility Note: Verify the processor marking and BGA pattern before use. The supported IC layout may vary between motherboard versions.