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AMAOE MT6879V 0.12mm CPU BGA Reballing Stencil for Dimensity 1050
βΉ229.00
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Product Description
AMAOE MT6879V 0.12mm CPU BGA Reballing Stencil
The AMAOE MT6879V is a 0.12mm CPU BGA reballing stencil designed for the MediaTek Dimensity 1050 chipset. It is used for accurate solder ball placement during CPU reballing and mobile motherboard repair.
The stencil provides the dedicated MT6879V CPU BGA pattern, helping technicians align the solder balls correctly on the chip during the reballing process.
Product Details
| Brand | AMAOE |
| Model | MT6879V |
| Chipset | MediaTek Dimensity 1050 (MT6879V) |
| Stencil Type | CPU BGA Reballing |
| Thickness | 0.12mm |
| Application | CPU BGA Reballing & Mobile Motherboard Repair |
π Shipping & Delivery Information
UToolsZone Fast & Reliable DeliveryWhen you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

π¦ Estimated Delivery Time
Total delivery time = Processing Time + Shipping Timeπ¦ Processing Time
Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.βοΈ Shipping Time
Shipping time refers to the duration your package takes to travel from our warehouse to your address.π Important Note
Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.Thank you for shopping with UToolsZone β€οΈ
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