AMAOE OV-1 0.12mm CPU BGA Reballing Stencil for OPPO and VIVO

AMAOE OV-1 0.12mm CPU BGA Reballing Stencil for OPPO and VIVO

β‚Ή179.00
Brand:
Model: OV-1
Availability: In Stock
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Product Description

The AMAOE OV-1 0.12mm CPU BGA Reballing Stencil is designed for CPU and motherboard repair on compatible OPPO and VIVO smartphones. It supports the MT6755V and MT6750V processor layouts listed for this stencil.

Key Features

  • Brand: AMAOE
  • Model: OV-1
  • Thickness: 0.12mm
  • Material: Japanese steel sheet
  • Type: CPU BGA reballing stencil
  • Supported Processors: MT6755V and MT6750V
  • Listed Compatible Models: OPPO R9, A59, A37, A3, A3s, A5 and A6; VIVO Y67 and V5
  • Application: CPU reballing and smartphone motherboard repair

The stencil helps align solder balls or solder paste with the matching BGA pad layout during chip rework.

Compatibility Note: Confirm the processor marking and BGA pattern before use, as phone variants may differ.

🚚 Shipping & Delivery Information

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