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AMAOE OV-6 Qualcomm CPU BGA Reballing Stencil for OPPO & Vivo
βΉ179.00
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Product Description
AMAOE OV-6 Qualcomm CPU BGA Reballing Stencil
The AMAOE OV-6 is a BGA reballing stencil designed for mobile phone motherboard repair. It supports compatible Qualcomm CPU layouts used in selected OPPO and Vivo smartphones.
Supported Chipsets
- Qualcomm Snapdragon 460 (SM4250)
- Qualcomm Snapdragon 720G (SM7125)
- Qualcomm Snapdragon 662 (SM6115)
Compatible Phone Models
- OPPO A32
- Vivo Y30
- Vivo Y31
- iQOO U1
Product Features
- Designed for compatible CPU BGA reballing applications.
- 0.12 mm stencil thickness.
- Made from Japanese steel sheet.
- Reusable stencil for mobile motherboard repair work.
Note: Verify the exact IC marking and ball layout before use to ensure compatibility.
π Shipping & Delivery Information
UToolsZone Fast & Reliable DeliveryWhen you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

π¦ Estimated Delivery Time
Total delivery time = Processing Time + Shipping Timeπ¦ Processing Time
Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.βοΈ Shipping Time
Shipping time refers to the duration your package takes to travel from our warehouse to your address.π Important Note
Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.Thank you for shopping with UToolsZone β€οΈ
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