The AMAOE OV-5 0.12mm CPU BGA Reballing Stencil is designed for CPU, RAM and motherboard IC reballing on compatible OPPO and VIVO smartphones. It supports multiple Qualcomm and MediaTek chip layouts used in the listed devices. Key Features Brand: AMAOE Model: OV-5 Thickness: 0.12mm Type: Universal CPU, RAM and IC BGA reballing stencil Supported Processors: Snapdragon 765G (SM7250) and MediaTek Dimensity 1000L (MT6855Z) Supported ICs: MT6885Z CPU/RAM, PM7250, PM7150A, MT6359VPP, MT6190W, MT6635XP and other listed IC layouts Compatible OPPO Models: Reno3, Reno3 Pro, Reno4 and Reno4 Pro Compatible VIVO Models: X50, X50 Pro, Z6 and iQOO Z1x Application: CPU/RAM reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding BGA pad layout during chip rework. Compatibility Note: Check the IC marking and stencil pattern before use. Compatibility depends on the specific motherboard and component layout.

AMAOE OV-6 Qualcomm CPU BGA Reballing Stencil The AMAOE OV-6 is a BGA reballing stencil designed for mobile phone motherboard repair. It supports compatible Qualcomm CPU layouts used in selected OPPO and Vivo smartphones. Supported Chipsets Qualcomm Snapdragon 460 (SM4250) Qualcomm Snapdragon 720G (SM7125) Qualcomm Snapdragon 662 (SM6115) Compatible Phone Models OPPO A32 Vivo Y30 Vivo Y31 iQOO U1 Product Features Designed for compatible CPU BGA reballing applications. 0.12 mm stencil thickness. Made from Japanese steel sheet. Reusable stencil for mobile motherboard repair work. Note: Verify the exact IC marking and ball layout before use to ensure compatibility.

The AMAOE OV-7 Universal CPU BGA Reballing Stencil is designed for mobile phone motherboard repair and compatible Qualcomm processor reballing. It helps technicians align solder balls with the BGA pad layout during chip-level repair. Key Features Universal-series CPU BGA reballing stencil. Designed for compatible Qualcomm Snapdragon processor layouts. Helps with accurate solder-ball placement during reballing. Suitable for mobile repair technicians and electronics workshops. Compatible Processor Models Qualcomm Snapdragon 7 Gen 1 Qualcomm SM7450 Qualcomm Snapdragon 680 Qualcomm SM6225 Product Specifications Brand: AMAOE Model: OV-7 Series: Universal CPU Series Product Type: CPU BGA Reballing Stencil Application: Mobile motherboard repair and CPU reballing Usage Note: Confirm the processor marking and stencil aperture layout before use to ensure compatibility with the target chip.

The AMAOE OV-8 CPU BGA Reballing Stencil is designed for mobile phone motherboard repair and compatible CPU reballing work. Its 0.12 mm thickness is specified in the supplied product title. It helps technicians align solder balls with the chip's BGA layout during rework. Key Features Designed for CPU BGA reballing and chip-level repair. 0.12 mm stencil thickness as listed by the supplier. Suitable for compatible processor layouts in selected smartphones. Helps with solder-ball placement during motherboard repair. Compatible Devices and IC Models OPPO: A96 vivo: Y77 realme: 10 Pro iQOO: U5 IC models listed: SM6375, MT6855V, MT6833V Product Specifications Brand: AMAOE Model: OV-8 Thickness: 0.12 mm Type: CPU BGA Reballing Stencil Application: Mobile motherboard repair and CPU reballing Important Note: Phone models can use different processor configurations depending on region. Confirm the actual IC marking and stencil aperture layout before use.

The AMAOE OV-9 CPU BGA Reballing Stencil is designed for mobile phone motherboard repair and compatible MediaTek processor reballing. It helps technicians align solder balls with the processor's BGA pad layout during chip-level repair. Key Features Designed for CPU BGA reballing and motherboard repair. 0.12 mm thickness as specified in the supplied product title. Intended for compatible MediaTek Dimensity processor layouts. Suitable for professional mobile repair and chip-level rework. Compatible Processor and Device Information Processor: MediaTek Dimensity 9200 IC model listed: MT6985W Device models listed by supplier: vivo X90, OPPO Find X6, iQOO Neo8 Pro Product Specifications Brand: AMAOE Model: OV-9 Thickness: 0.12 mm Product Type: CPU BGA Reballing Stencil Application: Mobile motherboard repair and CPU reballing Important Note: Verify the exact processor marking and stencil aperture pattern before use. Smartphone variants can have different processor configurations, so confirm compatibility with the actual board.

The AMAOE PM-2 Power IC BGA Reballing Stencil is designed for mobile phone motherboard repair involving compatible Qualcomm power management ICs. It helps technicians position solder balls according to the IC's BGA layout during chip-level rework. Key Features Designed for Qualcomm power IC BGA reballing. Suitable for compatible power management IC packages. Helps maintain accurate solder-ball placement during reballing. Useful for mobile repair technicians and electronics workshops. Compatible IC Models PM660 PM8937 PM8994 PMI8994 PM8952 PMI8952 Product Specifications Brand: AMAOE Model: PM-2 Series: Qualcomm PM Series Product Type: Power IC BGA Reballing Stencil Application: Mobile motherboard repair and power IC reballing Usage Note: Confirm the exact IC marking and stencil aperture layout before use. Stencil thickness and package contents should be verified with the supplier.

The AMAOE QU-1 Qualcomm CPU BGA Reballing Stencil is designed for chip-level mobile motherboard repair and CPU reballing. Product Specifications Brand: AMAOE Model: QU-1 Thickness: 0.12mm Material: Japanese steel sheet Type: Qualcomm CPU BGA Reballing Stencil Supported Chip Models MSM8996 A / B MSM8976 A / B MSM8992 A / B Applications Qualcomm CPU BGA reballing Mobile motherboard chip-level repair Solder ball placement on compatible CPU chips Compatibility Note: Confirm the exact chip model and BGA layout before use, as similar chipsets may have different ball layouts.

The AMAOE QU-2 Qualcomm CPU BGA Reballing Stencil is designed for mobile phone motherboard chip-level repair and CPU reballing work. Product Specifications Brand: AMAOE Model: QU-2 Thickness: 0.12mm Type: Qualcomm CPU BGA Reballing Stencil Material: Stainless steel Supported Chip Models MSM8953 B01 MSM8953 1AB MSM8937 MSM8916 MSM8998 A MSM8998 B Applications Qualcomm CPU BGA reballing Mobile motherboard chip-level repair Reapplying solder balls to compatible CPU chips Compatibility Note: Before use, confirm the chip model and BGA layout match the stencil pattern.

The AMAOE QU-3 0.12mm Qualcomm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible smartphones using supported Qualcomm processor layouts. Key Features Brand: AMAOE Model: QU-3 Thickness: 0.12mm Material: Japanese steel sheet Type: Qualcomm CPU BGA reballing stencil Supported Chipsets: MSM7225A, MSM8909, MSM8928A, MSM8928B, MSM8940, MSM8952, MSM8612 and SDM660 Compatible Brands: OPPO, VIVO, Xiaomi, Huawei and other smartphones using supported chipsets Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA pad layout during CPU rework. Compatibility Note: Check the processor marking and BGA pattern before use to ensure the stencil matches the IC being repaired.

The AMAOE QU-4 Qualcomm CPU BGA Reballing Stencil is designed for chip-level mobile motherboard repair and solder ball rework on compatible Qualcomm processors. Product Specifications Brand: AMAOE Model: QU-4 Thickness: 0.12mm Type: Qualcomm CPU BGA Reballing Stencil Material: Stainless steel Supported Chip Models MSM8994 A / B MSM8974 A / B MSM8960 A / B Applications Qualcomm CPU BGA reballing Compatible mobile motherboard repairs Chip-level solder ball rework Compatibility Note: Check the chip model and BGA pattern before use. The stencil is supplied as one piece.

AMAOE QU-5 Qualcomm CPU & RAM BGA Reballing Stencil The AMAOE QU-5 is a BGA reballing stencil designed for mobile phone motherboard repair. It supports selected Qualcomm processor and RAM IC layouts, helping technicians apply solder balls accurately during chip-level rework. Supported Chipsets and ICs SDM845 CPU and RAM SM8150 CPU and RAM SDM670 SDM710 MSM8917 SM6150 Product Features Designed for Qualcomm CPU and RAM BGA reballing applications. Suitable for mobile motherboard chip-level repair work. Helps align solder balls with the corresponding IC pad layout. Package Contents 1 × AMAOE QU-5 BGA Reballing Stencil Note: Verify the IC marking and ball layout before use to ensure compatibility with the QU-5 stencil.

The AMAOE QU-6 Qualcomm CPU BGA Reballing Stencil is designed for reballing compatible Qualcomm baseband, modem and CPU-related ICs during mobile motherboard repair. Product Specifications Brand: AMAOE Model: QU-6 Thickness: 0.12mm Material: Japanese steel sheet Hole Type: Square Type: BGA Reballing Stencil Reusable: Yes Supported Chip Models QSC6270 MDM9600 MSM6260 MSM7227 QSC1110 MDM6600 MSM6246 MSM8909W QSC1105 MDM8215 MDM9215M MSM7521 Applications Compatible Qualcomm IC BGA reballing Baseband and modem IC repair Mobile phone motherboard chip-level repair Compatibility Note: Confirm the exact IC model and solder-ball layout before use, as compatibility depends on the chip's BGA pattern.

The AMAOE QU-7 CPU BGA Reballing Stencil is designed for mobile phone motherboard repair and compatible Qualcomm Snapdragon processor reballing. It helps technicians align solder balls with the chip's BGA pad layout during chip-level repair. Key Features Designed for Qualcomm Snapdragon CPU BGA reballing. 0.12 mm stencil thickness as specified in the supplied product title. Suitable for compatible processor layouts in supported devices. Helps with accurate solder-ball placement during reballing. Compatible Processor Series Qualcomm Snapdragon 460 Qualcomm Snapdragon 665 Qualcomm Snapdragon 720G Qualcomm Snapdragon 730G Qualcomm Snapdragon 750G Qualcomm Snapdragon 765G Qualcomm Snapdragon 775G Product Specifications Brand: AMAOE Model: QU-7 Thickness: 0.12 mm Product Type: CPU BGA Reballing Stencil Application: Mobile motherboard repair and CPU reballing Usage Note: Confirm the processor marking and stencil aperture pattern before use. Compatibility can vary by chip package, so check the exact IC layout.

The AMAOE QU-8 Qualcomm CPU RAM BGA Reballing Stencil is designed for chip-level mobile motherboard repair and reballing of compatible Qualcomm CPU and RAM chips. Product Specifications Brand: AMAOE Model: QU-8 Thickness: 0.12mm Type: Qualcomm CPU and RAM BGA Reballing Stencil Material: Stainless steel Supported Chip Models SM8250-102 CPU SM8250-102 RAM SM8250-002 CPU SM8250-002 RAM SM8350 RAM SM8350 / Snapdragon 888 SDM439 Applications Compatible Qualcomm CPU and RAM reballing BGA solder ball replacement Mobile motherboard chip-level repair Compatibility Note: Confirm the exact chip model and stencil pattern before use, as CPU and RAM layouts may differ.

The AMAOE S901U-012 Middle Layer BGA Reballing Stencil is designed for motherboard repair and middle-layer reballing work on compatible Samsung Galaxy S22 series boards. It helps technicians align solder balls with the corresponding board layout during layer rework. Key Features Designed for middle-layer BGA reballing and motherboard repair. 0.12 mm stencil thickness as specified in the supplied product title. Intended for compatible Samsung Galaxy S22 series board layouts. Suitable for professional mobile repair and chip-level rework. Compatible Models Listed Samsung Galaxy S22 — SM-S901U Samsung Galaxy S22+ — SM-S906U Additional model suffixes listed by the supplier: W, 0, D and E Product Specifications Brand: AMAOE Model: S901U-012 Thickness: 0.12 mm Type: Middle Layer BGA Reballing Stencil Application: Samsung motherboard middle-layer repair Important Note: Confirm the complete Samsung model number and stencil layout before use. The supplied title groups multiple model suffixes together; verify exact compatibility with the supplier before listing all of them.

The AMAOE S908U-012 Middle Layer BGA Reballing Stencil is designed for Samsung Galaxy S22 Ultra motherboard repair. It helps technicians align solder balls during middle-layer reballing and board rework on compatible motherboard layouts. Key Features Designed for motherboard middle-layer BGA reballing. 0.12 mm stencil thickness as specified in the supplied product title. Intended for compatible Samsung Galaxy S22 Ultra board layouts. Suitable for professional mobile motherboard repair and rework. Compatible Models Samsung Galaxy S22 Ultra — SM-S908U Additional model suffixes listed by the supplier: W, 0, D and E Product Specifications Brand: AMAOE Model: S908U-012 Thickness: 0.12 mm Type: Middle Layer BGA Reballing Stencil Application: Samsung Galaxy S22 Ultra motherboard repair Usage Note: Verify the complete device model and stencil aperture layout before use to ensure compatibility with the motherboard being repaired.

The AMAOE S916U-012 Middle Layer BGA Reballing Stencil is designed for motherboard middle-layer repair on compatible Samsung Galaxy S23+ devices. It helps technicians align solder balls with the board's middle-layer layout during reballing and motherboard rework. Key Features Designed for middle-layer BGA reballing and motherboard repair. Made for compatible Samsung Galaxy S23+ board layouts. Helps with solder-ball alignment during middle-layer rework. Suitable for mobile repair technicians and electronics workshops. Compatible Models and Layout Device: Samsung Galaxy S23+ Model: SM-S916U Additional model listed: SM-S916W Board revision/layout: REV07E W44 Product Specifications Brand: AMAOE Model: S916U-012 Type: Middle Layer BGA Reballing Stencil Application: Samsung Galaxy S23+ motherboard repair Usage Note: Match the stencil layout and motherboard revision before use. Confirm compatibility with the supplier if the board revision differs.

The AMAOE S918U-012 Middle Layer BGA Reballing Stencil is designed for Samsung Galaxy S23 Ultra motherboard repair. It helps technicians align solder balls during middle-layer reballing and board rework. Key Features Designed for middle-layer BGA reballing. Suitable for compatible Samsung Galaxy S23 Ultra board layouts. Helps with accurate solder-ball alignment during repair. Compatible Models Samsung Galaxy S23 Ultra — SM-S918U Additional model suffixes listed by the supplier: W, 0, D and E Specifications Brand: AMAOE Model: S918U-012 Type: Middle Layer BGA Reballing Stencil Application: Samsung motherboard repair Note: Match the stencil layout with the motherboard model before use.

The AMAOE SAM1 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Samsung Galaxy devices using the Qualcomm MSM8998 processor layout specified for this stencil. Key Features Brand: AMAOE Model: SAM1 Thickness: 0.12mm Processor: Qualcomm MSM8998 Type: Multi-function CPU BGA reballing stencil Listed Compatible Models: Samsung Galaxy S8, S8 Plus and Note8 Application: CPU reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA layout during CPU rework. Compatibility Note: Verify the processor marking and BGA pattern on the motherboard before use, as device variants may differ.

The AMAOE SAM10 0.12mm CPU BGA Reballing Stencil is designed for professional mobile motherboard repair and CPU reballing. It supports compatible processors based on the Samsung Exynos 9820 and Qualcomm Snapdragon 855 (SM8150) platforms. Its multi-function BGA stencil layout helps technicians apply solder paste or position solder balls on compatible CPU contact patterns during reballing and chip repair. Product Specifications Brand: AMAOE Model: SAM10 Thickness: 0.12mm Type: Multi-function CPU BGA reballing stencil Supported platforms: Exynos 9820 and SM8150 Application: CPU reballing and mobile motherboard repair Compatible Devices Samsung Galaxy S10 Samsung Galaxy S10+ Samsung Galaxy S10 5G Samsung Galaxy Note10 Listed model references: G9730, G975, G977 and N975. Compatibility Note: Confirm the processor marking and BGA layout before use, as compatibility may vary by device variant and motherboard revision.

The AMAOE SAM11 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and mobile motherboard repair on compatible Samsung devices. It supports the listed Qualcomm Snapdragon 710 (SDM710) and Samsung Exynos 7904 processor platforms. The multi-function BGA stencil helps technicians position solder paste or solder balls on the compatible CPU contact layout during chip rework. Its 0.12mm thickness is intended for the specified stencil pattern. Product Specifications Brand: AMAOE Model: SAM-11 Thickness: 0.12mm Type: Multi-function CPU BGA reballing stencil Supported processor platforms: Qualcomm SDM710 and Samsung Exynos 7904 Application: CPU reballing and mobile motherboard repair Listed Compatible Devices and Model References Samsung Galaxy J7 — J720 Samsung Galaxy A30 — A305 Samsung Galaxy A8s — G8870 / G887 Samsung Galaxy A40s Compatibility Note: Confirm the processor marking and BGA layout before use. Phone model codes and processor platforms can vary by region, so verify compatibility with the actual motherboard.

AMAOE SAM12 0.12mm CPU BGA Reballing Stencil The AMAOE SAM12 is a multi-function BGA reballing stencil designed for professional mobile motherboard repair. It is listed for compatible Qualcomm Snapdragon 865 (SM8250) and Samsung Exynos 990 CPU layouts used in the Samsung Galaxy S20 series. Product Specifications Brand AMAOE Model SAM12 Thickness 0.12mm Stencil Type Multi-Function CPU BGA Reballing Stencil CPU Platforms Qualcomm Snapdragon 865 (SM8250) and Samsung Exynos 990 Application CPU reballing and mobile motherboard repair Compatible Samsung Galaxy Devices Samsung Galaxy S20 Samsung Galaxy S20+ Samsung Galaxy S20 Ultra Note: Compatibility depends on the installed processor and motherboard version. Check the CPU marking and stencil pattern before reballing. Key Features Designed for compatible CPU BGA reballing work. 0.12mm stencil thickness. Multi-function layout for supported chip patterns. Suitable for professional smartphone motherboard repair and chip rework. Package Contents: 1 × AMAOE SAM12 0.12mm BGA Reballing Stencil.

AMAOE SAM13 CPU BGA Reballing Stencil The AMAOE SAM13 CPU BGA Reballing Stencil is designed for mobile phone motherboard repair and CPU reballing work. The listed stencil layouts cover selected Qualcomm Snapdragon and MediaTek processor platforms used in compatible Samsung Galaxy A-series devices. Product Specifications Brand AMAOE Model SAM13 Stencil Type CPU BGA Reballing Stencil Net Listed Processor Platforms SDM450, Snapdragon 660, SM6150 and MT6762 Application CPU reballing and mobile motherboard repair Listed Compatible Devices Samsung Galaxy A10s Samsung Galaxy A60 — SM-A606 series reference Samsung Galaxy A70 — SM-A705F reference Samsung Galaxy A80 — SM-A805 series Samsung Galaxy A9 (2018) — SM-A920F reference Additional model reference: A605F Key Features Designed for compatible CPU BGA reballing tasks. Supports the processor layouts listed for this stencil model. Useful for smartphone motherboard repair and chip-level servicing. Helps align solder balls or solder paste with the matching BGA pattern. Compatibility Note: Processor layouts may vary by phone model and regional version. Confirm the actual CPU marking and stencil pattern before reballing.

The AMAOE SAM14 CPU BGA Reballing Stencil is designed for CPU reballing and motherboard-level repair on compatible Samsung Galaxy A-series smartphones. It supports listed Samsung Exynos processor platforms, making it useful for technicians performing chip-level repair and rework. Key Features Brand: AMAOE Model: SAM14 Type: CPU BGA reballing stencil Supported Processors: Exynos 7870, 7884, 7885, 7904, 9610 and 9611 Compatible Series: Selected Samsung Galaxy A-series models from A10 to A70 Application: CPU reballing and mobile motherboard repair The stencil helps align solder balls or solder paste with the matching CPU BGA layout during reballing. Always check the processor marking and stencil pattern before starting the repair. Compatibility Note: Support may vary by device variant and motherboard revision. Confirm the exact CPU layout before use.

The AMAOE SAM15 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard-level repair on compatible Samsung Galaxy S21 series devices. It helps mobile repair technicians align solder balls or solder paste with the matching BGA contact pattern during chip rework. Key Features Brand: AMAOE Model: SAM15 Thickness: 0.12mm Type: CPU BGA reballing stencil Compatible Series: Samsung Galaxy S21, S21+ and S21 Ultra Application: CPU reballing and smartphone motherboard repair Compatibility Note: CPU layouts can vary between regional variants and motherboard revisions. Verify the processor marking and stencil pattern before use.

The AMAOE SAM16 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and mobile motherboard repair involving compatible Samsung Exynos 1280 processor layouts. It is intended for technicians carrying out chip-level servicing and BGA rework. Key Features Brand: AMAOE Model: SAM16 Thickness: 0.12mm Type: CPU BGA reballing stencil Supported Processor: Samsung Exynos 1280 / E8825 Application: CPU reballing and smartphone motherboard repair The stencil helps align solder balls or solder paste with the matching BGA pattern during CPU reballing. Check the processor marking and stencil layout before starting the repair. Compatibility Note: Confirm the exact processor and motherboard layout before use, as compatibility may vary by device model and revision.

The AMAOE SAM17 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and chip-level motherboard repair on compatible Samsung Galaxy S22 series devices. It is listed for the Qualcomm Snapdragon 8 Gen 1 (SM8450) and Samsung Exynos 2200 (S5E9925) processor platforms. Key Features Brand: AMAOE Model: SAM17 Thickness: 0.12mm Type: CPU BGA reballing stencil Supported Platforms: Snapdragon 8 Gen 1 (SM8450) and Exynos 2200 (S5E9925) Compatible Series: Samsung Galaxy S22 series, subject to processor variant Application: CPU reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the matching CPU BGA layout during chip rework. Compatibility Note: Snapdragon and Exynos versions may use different motherboard layouts. Confirm the installed processor and stencil pattern before use.

The AMAOE SAM18 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard-level repair on compatible Samsung Galaxy devices. It is listed for the Samsung Exynos 1330 (E8535P) and Exynos 1380 (E8835P) processor platforms. Key Features Brand: AMAOE Model: SAM18 Thickness: 0.12mm Type: CPU BGA reballing stencil Supported Processors: Exynos 1330 (E8535P) and Exynos 1380 (E8835P) Compatible Devices: Samsung Galaxy A14 and Galaxy A54, subject to processor variant Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA contact pattern during CPU rework. Compatibility Note: Check the installed processor and BGA layout before use. Compatibility may vary by regional model and motherboard revision.

The AMAOE SAM19 CPU BGA Reballing Stencil is designed for CPU reballing and chip-level motherboard repair on compatible Samsung Galaxy devices. It is listed for Qualcomm Snapdragon processor platforms, including the Snapdragon 8 Gen 2 (SM8550) and Snapdragon 8 Gen 3 (SM8650). Key Features Brand: AMAOE Model: SAM19 Type: CPU BGA reballing stencil Supported Processors: Snapdragon 8 Gen 2 (SM8550) and Snapdragon 8 Gen 3 (SM8650) Listed Compatible Devices: Samsung Galaxy S23, S23 Ultra, S24 and S24 Ultra Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding CPU BGA pattern during chip rework. Compatibility Note: Processor and motherboard layouts can differ between device variants. Confirm the installed chipset and stencil pattern before use.

The AMAOE SAM20 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard-level repair on compatible Samsung Galaxy devices. It is listed for the MediaTek MT6835V processor platform. Key Features Brand: AMAOE Model: SAM20 Thickness: 0.12mm Type: CPU BGA reballing stencil Supported Processor: MediaTek MT6835V Listed Model References: SM-A156U and SM-A156E Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA contact pattern during CPU rework. Compatibility Note: Verify the processor marking and BGA layout on the actual motherboard before use, as regional variants may differ.