AMAOE QU-1 0.12mm Qualcomm CPU BGA Reballing Stencil

Name: AMAOE QU-1 0.12mm Qualcomm CPU BGA Reballing Stencil
Brand: AMAOE
SKU: QU-1
Availability: InStock

₹179.00

Brand: AMAOE

Model: QU-1

Availability: In Stock

Qty

🚚 Check Delivery Availability

Add to wishlist
Add to compare

Tags: Qualcomm CPU AMAOE QU-1 BGA

Categories Cart Account Search Recent View Go to Top

Description
Shipping Methods

Product Description

The AMAOE QU-1 Qualcomm CPU BGA Reballing Stencil is designed for chip-level mobile motherboard repair and CPU reballing.

Product Specifications

Brand: AMAOE
Model: QU-1
Thickness: 0.12mm
Material: Japanese steel sheet
Type: Qualcomm CPU BGA Reballing Stencil

Supported Chip Models

MSM8996 A / B
MSM8976 A / B
MSM8992 A / B

Applications

Qualcomm CPU BGA reballing
Mobile motherboard chip-level repair
Solder ball placement on compatible CPU chips

Compatibility Note: Confirm the exact chip model and BGA layout before use, as similar chipsets may have different ball layouts.

Show More Show Less

🚚 Shipping & Delivery Information

UToolsZone Fast & Reliable Delivery

When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

📦 Estimated Delivery Time

Total delivery time = Processing Time + Shipping Time

📦 Processing Time

Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

Shipping time refers to the duration your package takes to travel from our warehouse to your address.

🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.