AMAOE QU-3 0.12mm Qualcomm CPU BGA Reballing Stencil

Name: AMAOE QU-3 0.12mm Qualcomm CPU BGA Reballing Stencil
Brand: AMAOE
SKU: QU-3
Availability: InStock

₹179.00

Brand: AMAOE

Model: QU-3

Availability: In Stock

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Product Description

The AMAOE QU-3 0.12mm Qualcomm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible smartphones using supported Qualcomm processor layouts.

Key Features

Brand: AMAOE
Model: QU-3
Thickness: 0.12mm
Material: Japanese steel sheet
Type: Qualcomm CPU BGA reballing stencil
Supported Chipsets: MSM7225A, MSM8909, MSM8928A, MSM8928B, MSM8940, MSM8952, MSM8612 and SDM660
Compatible Brands: OPPO, VIVO, Xiaomi, Huawei and other smartphones using supported chipsets
Application: CPU reballing and smartphone motherboard repair

The stencil helps technicians align solder balls or solder paste with the matching BGA pad layout during CPU rework.

Compatibility Note: Check the processor marking and BGA pattern before use to ensure the stencil matches the IC being repaired.

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📦 Estimated Delivery Time

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✈️ Shipping Time

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🌍 Important Note

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