AMAOE QU-6 0.12mm Qualcomm CPU BGA Reballing Stencil

Name: AMAOE QU-6 0.12mm Qualcomm CPU BGA Reballing Stencil
Brand: AMAOE
SKU: QU-6
Availability: InStock

₹179.00

Brand: AMAOE

Model: QU-6

Availability: In Stock

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Tags: Qualcomm IC AMAOE QU-6 BGA

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Description
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Product Description

The AMAOE QU-6 Qualcomm CPU BGA Reballing Stencil is designed for reballing compatible Qualcomm baseband, modem and CPU-related ICs during mobile motherboard repair.

Product Specifications

Brand: AMAOE
Model: QU-6
Thickness: 0.12mm
Material: Japanese steel sheet
Hole Type: Square
Type: BGA Reballing Stencil
Reusable: Yes

Supported Chip Models

QSC6270
MDM9600
MSM6260
MSM7227
QSC1110
MDM6600
MSM6246
MSM8909W
QSC1105
MDM8215
MDM9215M
MSM7521

Applications

Compatible Qualcomm IC BGA reballing
Baseband and modem IC repair
Mobile phone motherboard chip-level repair

Compatibility Note: Confirm the exact IC model and solder-ball layout before use, as compatibility depends on the chip's BGA pattern.

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🚚 Shipping & Delivery Information

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📦 Estimated Delivery Time

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📦 Processing Time

Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.