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AMAOE SAM22 0.12mm CPU BGA Reballing Stencil for Samsung Galaxy A17
βΉ199.00
βΉ229.00
-13%
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Product Description
The AMAOE SAM22 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and chip-level motherboard repair on compatible Samsung Galaxy A17 devices. It is listed for selected processor layouts, including MT6789V, SM6475 and MT6769V.
Key Features
- Brand: AMAOE
- Model: SAM22
- Thickness: 0.12mm
- Type: CPU BGA reballing stencil
- Listed Processor Codes: MT6789V, SM6475 and MT6769V
- Compatible Device: Samsung Galaxy A17, subject to processor and board layout
- Application: CPU reballing and mobile motherboard repair
The stencil helps technicians align solder balls or solder paste with the matching BGA contact pattern during chip rework.
Compatibility Note: Processor codes can correspond to different device platforms. Confirm the actual chipset marking and stencil layout against the motherboard before use.
π Shipping & Delivery Information
UToolsZone Fast & Reliable DeliveryWhen you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

π¦ Estimated Delivery Time
Total delivery time = Processing Time + Shipping Timeπ¦ Processing Time
Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.βοΈ Shipping Time
Shipping time refers to the duration your package takes to travel from our warehouse to your address.π Important Note
Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.Thank you for shopping with UToolsZone β€οΈ
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