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AMAOE SAM9 0.12mm Exynos CPU BGA Reballing Stencil for Samsung Galaxy J1, J2, J3 and J4 Series
βΉ199.00
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Product Description
The AMAOE SAM9 0.12mm BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Samsung Galaxy J-series devices. It supports the processor families listed by the supplier for chip-level repair work.
Key Features
- Brand: AMAOE
- Model: SAM9
- Thickness: 0.12mm
- Type: CPU BGA reballing stencil
- Listed Processor Support: Exynos 7570, Exynos 3475, SC9830A and 7730S
- Listed Compatible Series: Samsung Galaxy J1, J2, J3 and J4
- Application: CPU reballing and mobile motherboard repair
The stencil helps technicians align solder balls or solder paste with the matching BGA layout during chip rework.
Compatibility Note: Processor and motherboard configurations can vary by model and region. Verify the processor marking and BGA pattern before using the stencil.
π Shipping & Delivery Information
UToolsZone Fast & Reliable DeliveryWhen you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

π¦ Estimated Delivery Time
Total delivery time = Processing Time + Shipping Timeπ¦ Processing Time
Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.βοΈ Shipping Time
Shipping time refers to the duration your package takes to travel from our warehouse to your address.π Important Note
Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.Thank you for shopping with UToolsZone β€οΈ
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