AMAOE SM6450 0.12mm CPU BGA Reballing Stencil for Snapdragon 6 Gen 1 & Honor X50

Name: AMAOE SM6450 0.12mm CPU BGA Reballing Stencil for Snapdragon 6 Gen 1 & Honor X50
Brand: AMAOE
SKU: SM6450
Availability: InStock

₹249.00

Brand: AMAOE

Model: SM6450

Availability: In Stock

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Tags: SM6450 Snapdragon 6 Gen 1 Honor X50

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AMAOE SM6450 0.12mm CPU BGA Reballing Stencil

The AMAOE SM6450 is a 0.12mm CPU BGA reballing stencil designed for the Qualcomm Snapdragon 6 Gen 1 platform. It is suitable for CPU reballing work on compatible devices such as the Honor X50.

The stencil provides the required aperture pattern for SM6450 CPU reballing and solder ball placement during motherboard repair.

Brand	AMAOE
Model	SM6450
Compatible CPU	Qualcomm Snapdragon 6 Gen 1 (SM6450)
Compatible Device	Honor X50
Thickness	0.12mm
Type	CPU BGA Reballing Stencil

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