FORWARD FW-HA05 Professional High Power BGA Desoldering & Rework Machine

FORWARD FW-HA05 800W High Power Spiral Wind BGA Desoldering Station

The FORWARD FW-HA05 is a professional 800W high-power hot air desoldering station developed for mobile phone motherboard repair, BGA chip removal, CPU rework and precision electronic component servicing. It features an advanced Soft Spiral Wind airflow system that distributes heat more uniformly across the working area, helping reduce thermal shock to sensitive electronic components during desoldering.

Powered by a high-performance blower and PID temperature control technology, the FW-HA05 provides stable heating and precise temperature regulation. Its automatic sleep and cooling functions, high-definition LCD segment display and three-channel memory make it convenient for professional technicians performing regular motherboard and PCB repair work.

Key Features

• 800W High-Power Heating: Provides powerful heating performance for BGA desoldering, IC removal and demanding motherboard repair applications.
• Soft Spiral Wind Technology: Produces uniform hot air distribution to help reduce thermal shock and provide more controlled heating around delicate components.
• Precision PID Temperature Control: Maintains stable heating with a constant temperature accuracy of ±2°C.
• Wide Temperature Range: Adjustable temperature from 100°C to 500°C for different soldering and desoldering requirements.
• High-Performance Blower: The fan operates at approximately 13,000 RPM for consistent hot air delivery.
• Automatic Sleep Function: Automatically enters standby when the handle is returned to its holder, helping reduce unnecessary heating.
• Automatic Cooling: Supports automatic cool-air operation during standby to help protect the heating element and extend its service life.
• Three-Channel Memory: Stores frequently used temperature and airflow settings for convenient switching between repair tasks.
• High-Definition LCD Display: Provides clear operating information through an LCD segment-code display.
• Precision Encoder Knob: Allows convenient adjustment of temperature and airflow settings.
• Ultra-Low Wind Resistance Nozzle: Designed to support efficient airflow and controlled heating during precision component removal.

Technical Specifications

• Brand: FORWARD
• Model: FW-HA05
• Product Type: High Power Hot Air BGA Desoldering Station
• Input Voltage: 110V / 220V AC
• Power: 800W
• Maximum Input Current: 7.3A at 110V / 3.6A at 220V
• Temperature Range: 100°C–500°C
• Temperature Accuracy: ±2°C
• Fan Speed: 13,000 RPM
• Airflow Adjustment: 5%–100%
• Airflow Technology: Soft Spiral Wind
• Temperature Control: PID Control
• Display: LCD Segment-Code Display
• Memory: Three-Channel Memory Function
• Sleep Function: Automatic Sleep and Cooling
• Product Dimensions: Approx. 120 × 227 × 175 mm
• Product Weight: Approx. 2.2 kg

Applications

• BGA chip desoldering and replacement
• Mobile phone motherboard repair
• CPU and IC removal and rework
• SMD component soldering and desoldering
• PCB repair and electronic circuit maintenance
• Professional chip-level repair and servicing

Package Contents

• 1 × FORWARD FW-HA05 Hot Air Desoldering Station
• 5 × Hot Air Nozzles
• 1 × AC Power Cable
• 1 × Instruction Manual
• 1 × Warranty Card
• 1 × Manufacturer Certificate