MECHANIC QC-20 BGA IC Black Glue Remover Liquid for Motherboard Repair (20ml)

Name: MECHANIC QC-20 BGA IC Black Glue Remover Liquid for Motherboard Repair (20ml)
Brand: MECHANIC
SKU: QC-20
Availability: InStock

₹399.00

Brand: MECHANIC

Model: QC-20

Availability: In Stock

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Tags: QC-20 BGA Glue Remover IC Repair

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Description
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Product Description

MECHANIC QC-20 is a specialized liquid solution designed to soften and remove hardened sealing glue and resin around BGA IC chips during mobile phone motherboard repair. It helps technicians loosen stubborn adhesive for chip-level repair and rework.

Key Features

Liquid glue remover for BGA IC chip repair.
Helps soften hardened black glue and resin adhesives.
Suitable for mobile phone motherboard repair.
Works on various cured resin adhesives, including epoxy and acrylic-based adhesives.
20ml bottle for professional repair use.

Specifications

Brand: MECHANIC
Model: QC-20
Product Type: BGA IC Glue Removing Liquid
Capacity: 20ml
Application: Mobile motherboard and BGA IC glue removal

Safety Precautions

This solution is weakly acidic. Open the bottle carefully, avoid contact with eyes and skin, and use it in a well-ventilated area. Follow the product instructions and keep it away from children. For professional repair use only.

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📦 Estimated Delivery Time

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📦 Processing Time

Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.